Polishing apparatus

• US 6,984,164 B2
• Filed: 06/10/2004
• Issued: 01/10/2006
• Est. Priority Date: 01/17/2000
• Status: Expired due to Term

• Current Assignee: Ebara Corporation
• Original Assignee: Ebara Corporation
• Inventors: Kimura, Norio, Shimizu, Kazuo, Osawa, Hiroyuki, Isobe, Hideji
• Primary Examiner(s): Thomas, David B.
• Application Number:
  US10/864,322
• Publication Number:
  US 20040224613A1
• Time in Patent Office: 579 Days
• Field of Search: 451 5- 8
• US Class Current: 451/8
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24B 49/04 involving measurement of the workpiece at the place of grinding during grinding operation
• CPC Class Codes: B24B 49/10 involving electrical means B24B49/02, B24B49/08 take precedence
• CPC Class Codes: H01L 21/30625 With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Abstract

A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.

Claims

1. A polishing apparatus comprising:

a polishing table having a polishing surface;

a top ring for holding a substrate and pressing a surface of the substrate against said polishing surface to polish the surface of the substrate; and

an eddy-current sensor for measuring the thickness of a conductive layer formed on the surface of the substrate to produce a detected signal indicating a polishing uniformity of the surface of the substrate in a substantially diametrical direction of the substrate as said eddy-current sensor passes beneath the surface of the substrate along an arc.

2. The polishing apparatus as recited in claim 1, further comprising a controller operable to process the detected signal from said eddy-current sensor.

3. The polishing apparatus as recited in claim 2, wherein said controller is operable to change a polishing condition of said polishing apparatus.

4. The polishing apparatus as recited in claim 3, wherein said controller is operable to change a distribution of pressures applied to the surface of the substrate.

5. The polishing apparatus as recited in claim 3, wherein said controller is operable to change a pressing force applied to said top ring to press the substrate.

6. The polishing apparatus as recited in claim 1, wherein said arc includes the center of the substrate.