Method and probe structure for implementing a single probe location for multiple signals
First Claim
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1. A method for implementing multiple signals probing of a printed circuit board comprising the steps of:
- providing a pattern of vias in the printed circuit board including multiple predefined vias, each said predefined via being connected to a respective signal to be monitored;
forming a probe structure on an outside surface of the printed circuit board including a pattern of a plurality of spaced apart electrically conductive stubs, each stub including an elongated portion extending from at least one pad, and said pattern including one of said plurality of stubs adjacent each said predefined via connected to said respective signal to be monitored;
electrically connecting a resistor between one said predefined via connected to one said respective signal to be monitored and said adjacent stub; and
defining a path to a predefined probe location on the printed circuit board for monitoring said signal from said resistor using said probe structure by placing zero-ohm shorts between selected ones of said pads of said plurality of stubs of said probe structure.
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Abstract
A method and a probe structure are provided for implementing multiple signals probing of a printed circuit board. A probe structure is formed on an outside surface of the printed circuit board. A resistor is electrically connected with an associated via with a signal to be monitored. A path to a predefined probe location for monitoring the signal is defined from the resistor using the probe structure.
6 Citations
11 Claims
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1. A method for implementing multiple signals probing of a printed circuit board comprising the steps of:
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providing a pattern of vias in the printed circuit board including multiple predefined vias, each said predefined via being connected to a respective signal to be monitored; forming a probe structure on an outside surface of the printed circuit board including a pattern of a plurality of spaced apart electrically conductive stubs, each stub including an elongated portion extending from at least one pad, and said pattern including one of said plurality of stubs adjacent each said predefined via connected to said respective signal to be monitored; electrically connecting a resistor between one said predefined via connected to one said respective signal to be monitored and said adjacent stub; and defining a path to a predefined probe location on the printed circuit board for monitoring said signal from said resistor using said probe structure by placing zero-ohm shorts between selected ones of said pads of said plurality of stubs of said probe structure. - View Dependent Claims (2, 3, 4, 5, 6)
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7. Apparatus for implementing multiple signals probing of a printed circuit board comprising:
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a pattern of vias in the printed circuit board including multiple predefined vias, each said predefined via being connected to a respective signal to be monitored; a probe structure formed on an outside surface of the printed circuit board;
said probe structure including an electrically conductive material forming a pattern of a plurality of spaced apart stubs defining said probe structure on said outside surface of the printed circuit board, each said stub including an elongated portion extending from at least one pad;
said pattern including one of said plurality of stubs adjacent each said predefined via connected to said respective signal to be monitored;a resistor electrically connected between one said predefined via connected to one said respective signal to be monitored and said adjacent stub; and a path defined to a predefined probe location for monitoring said signal from said resistor using said probe structure;
said path being formed by electrically shorting between said pads of selected ones of said plurality of spaced apart stubs. - View Dependent Claims (8, 9, 10, 11)
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Specification