Multi-dimensional transducer arrays and method of manufacture

• US 6,994,674 B2
• Filed: 06/27/2002
• Issued: 02/07/2006
• Est. Priority Date: 06/27/2002
• Status: Active Grant

• Current Assignee: Siemens Medical Solutions USA Incorporated (Siemens AG)
• Original Assignee: Siemens Medical Solutions USA Incorporated (Siemens AG)
• Inventors: Frey, Gregg W., Guo, Xiaocong, Ayter, Sevig, Englund, Stephen C., Sheljaskow, Todor, Palczewska, Grazyna, Ho, Ron, Houck, Thomas G.
• Primary Examiner(s): IMAM, ALI M
• Application Number:
  US10/184,785
• Publication Number:
  US 20040002656A1
• Time in Patent Office: 1,321 Days
• Field of Search: 600437-472, 310/317, 310/319, 310/322, 310/334, 310335-337, 128/916, 736/02, 736/42
• US Class Current: 600/459
• CPC Class Codes: A61B 8/483 involving the acquisition of a 3D volume of data
• CPC Class Codes: B06B 1/0622 on one surface
• CPC Class Codes: G01S 15/8925 the array being a two-dimensional transducer configuration, i.e. matrix or orthogonal linear arrays
• CPC Class Codes: G01S 15/8961 using pulse compression
• CPC Class Codes: G01S 7/003 Transmission of data between radar, sonar or lidar systems and remote stations
• CPC Class Codes: G01S 7/5202 for pulse systems
• CPC Class Codes: G01S 7/5208 with integration of processing functions inside probe or scanhead
• CPC Class Codes: G10K 11/346 using phase variation

Abstract

A multi-dimensional transducer array has pitch along one dimension less than the pitch along a second dimension. The multi-dimensional transducer array with the same or different pitch is manufactured from a plurality of modules. Each of the modules are separately diced and then aligned and combined. Elements of a transducer array are used for isolating a transmit channel from a receive channel. Separate signal lines or traces are provided individually for each element on opposite sides of each element. A transmit channel may connect to one electrode on an element, and the receive channel may connect to an opposite electrode on the element. A multi-dimensional array is provided for time division multiplex processing. A probe houses the multi-dimensional array and a multiplexer.

Claims

1. A multi-dimensional transducer array for ultrasound imaging, the array comprising:

a first plurality of elements spaced along a first dimension; and

a second plurality of elements spaced along second dimension, the second dimension different than the first dimension, the first plurality of elements having a first element-to-element and kerf-to-kerf spacing less than a second element-to-element and kerf-to-kerf spacing of the second plurality of elements;

wherein the first and second element-to-element spacings are first and second distances between centers of elements, respectively, the second distances each corresponding to a wavelength of operation and the first distances each corresponding to a fraction of the wavelength.

2. The array of claim 1 wherein the first element-to-element spacing is about ½

the second element-to-element spacing.

3. The array of claim 1 wherein the first element-to-element spacing is less than ⅔

the second element-element spacing.

4. The array of claim 1 further comprising:

a probe housing the first and second pluralities of elements; and

a multiplexer electrically connected with the first and second pluralities of elements, the multiplexer within the probe.

5. The array of claim 4 further comprising:

a plurality N of signal lines connectable from the multiplexer to a base unit, where N is less than a product of a number of the first and second pluralities of elements.

6. The array of claim 4 further comprising a transmit board and a receive board electrically connected with the first and second pluralities of elements, the transmit and receive boards within the probe.

7. The array of claim 1 further comprising:

a first electrode on a top side of one element of the first plurality of elements;

a second electrode on a bottom side of the one element;

a transmit path connected to the first electrode; and

a receive path connected to the second electrode, the receive path separate from the transmit path at the transducer element.

8. The array of claim 1 further comprising:

first separated signal electrodes on a top side of each element of the first and second pluralities of elements; and

second separated signal electrodes on a bottom side of each element of the first and second pluralities of elements.

9. The array of claim 1 wherein the second plurality of elements comprise first and second elevation spaced modules of elements, the first elevation spaced module separated from the second elevation spaced module of elements by a plurality of sheets of flexible circuit material.

10. The array of claim 9 the first module of elements is responsive to first and second flexible circuits on tops and bottoms, respectively, of the elements of the first module, and the second module of elements is responsive to third and fourth flexible circuits on tops and bottoms, respectively, of the elements of the second module, the first, second, third and fourth flexible circuits extending along sides of and between the first and second modules.

11. The array of claim 1 wherein the elements comprise microelectromechanical elements.

12. A method of manufacturing a multi-dimensional ultrasound transducer array, the method comprising:

(a) dicing a first module of elements;

(b) dicing a second module of elements; and

(c) aligning the first and second modules after (a) and (b), the first module adjacent to the second module;

wherein the aligned first and second modules of elements comprise a multi-dimensional array of elements in an azimuth and elevation plane.

13. The method of claim 12 further comprising:

(d) framing the aligned first and second modules; and

(e) filling kerfs responsive to (a) and (b) after (d).

14. The method of claim 12 wherein (a) comprises forming a first sub-array of elements, the first sub-array of elements having at least two rows of elements and at least two columns of elements, wherein (b) comprises forming a second sub-array of elements, the second sub-array of elements having at least two rows of elements and at least two columns of elements.

15. The method of claim 12 further comprising:

(d) bonding two layers of electrodes with first piezoelectric material prior to (a); and

(e) bonding two layers of electrodes with second piezoelectric material prior to (b);

wherein (a) comprises dicing the first piezoelectric material and (b) comprises dicing the second piezoelectric material.

16. The method of claim 12 further comprising:

(d) folding a first flexible circuit layer along a first side of the first module so that the first flexible circuit layer extends from first piezoelectric material towards first backing material;

(e) folding a second flexible circuit layer along a second side of the second module so that the second flexible circuit layer extends from second piezoelectric material towards second backing material;

wherein (c) comprises aligning the first side of the first module adjacent to the second side of the second module, the first and second flexible circuit layers separating the first and second sides.

18. The method of claim 12 further comprising:

(d) connecting a multiplexer with at least two of the elements; and

(e) positioning the first and second modules of elements and the multiplexer in a probe.

19. The method of claim 18 further comprising:

(f) connecting a plurality of cables to the multiplexer, the plurality of cables being fewer than a number of elements.

20. The method of claim 18 wherein (e) comprises positioning a circuit board comprising at least the multiplexer in the probe.

21. The method of claim 12 wherein (a) comprises dicing along an azimuth dimension without about half a spacing as along an elevation dimension.

17. The method of 12 wherein (a) comprises simultaneously dicing through first and second layers of flexible circuit material separated by piezoelectric material of the first module, and (b) comprises simultaneously dicing through third and fourth layers of flexible circuit material separated by piezoelectric material of the second module, wherein (a) and (b) are one of simultaneous acts and acts occurring at different times.

22. A multi-dimensional transducer array for ultrasound imaging, the array comprising:

a first plurality of elements spaced along a first dimension; and

a second plurality of elements spaced along second dimension, the second dimension different than the first dimension;

first separated signal electrodes on atop side of each element of the first and second pluralities of elements; and

second separated signal electrodes on a bottom side of each element of the first and second pluralities of elements.

23. The array of claim 22 wherein the first plurality of elements have a first element-to-element spacing less than a second element-to-element spacing of the second plurality of elements.

24. The array of claim 22 wherein the elements comprise microelectromechanical elements.

25. A multi-dimensional transducer array for Ultrasound imaging, the array comprising:

a plurality of transducer elements arrange with N elements along a first dimension where N is greater than one and with M elements along a second dimension where M is greater than one and not equal to N;

a probe housing the plurality of transducer elements; and

a multiplexer connected to at least two of the plurality of transducer elements, the multiplexer within the probe, wherein the plurality of transducer elements comprise a 1.5D array.

26. A multi-dimensional transducer array for Ultrasound imaging, the array comprising:

a plurality of transducer elements arrange with N elements along a first dimension where N is greater than one and with M elements along a second dimension where M is greater than one and not equal to N;

a probe housing the plurality of transducer elements; and

a multiplexer connected to at least two of the plurality of transducer elements, the multiplexer within the probe, wherein the plurality of transducer elements comprise a one dimensional array of elements along the first dimension and layers of elements along the second dimension, the second dimension comprising a range dimension.

27. A multi-dimensional transducer array for Ultrasound imaging, the array comprising:

a plurality of transducer elements arrange with N elements along a first dimension where N is greater than one and with M elements along a second dimension where M is greater than one and not equal to N;

a probe housing the plurality of transducer elements; and

a multiplexer connected to at least two of the plurality of transducer elements, the multiplexer within the probe, wherein the plurality of transducer elements comprise an array having isolated left and right sides of an elevation aperture and variation in thickness as a function of elevation aperture.

28. A multi-dimensional transducer my for Ultrasound imaging, the array comprising:

a plurality of transducer elements arrange with N elements along a first dimension where N is greater than one and with M elements along a second dimension where M is greater than one and not equal to N;

a probe housing the plurality of transducer elements; and

a multiplexer connected to at least two of the plurality of transducer elements, the multiplexer within the probe, wherein the plurality of transducer elements comprise a first linear array along the first dimension and a second linear array along the second dimension.

29. A multi-dimensional transducer array for ultrasound imaging, the array comprising:

a first plurality of elements spaced along a first dimension; and

at least one element spaced along second dimension, the second dimension different than the first dimension;

first separated signal electrodes on a top side of each element of the first plurality of elements and the at least one element; and

second separated signal electrodes on a bottom side of each element of the first plurality of elements and the at least one element.

30. A multi-dimensional transducer array for Ultrasound imaging, the array comprising:

a plurality of transducer elements arrange with N elements along a first dimension where N is greater than one and with M elements along a second dimension where M is greater than one and not equal to N;

a probe housing the plurality of transducer elements; and

a multiplexer connected to at least two of the plurality of transducer elements, the multiplexer within the probe, wherein the elements comprise microelectromechanical elements.