Semiconductor light emitting device

• US 7,012,277 B2
• Filed: 12/23/2003
• Issued: 03/14/2006
• Est. Priority Date: 01/06/2003
• Status: Expired due to Term

• Current Assignee: LedComm LLC (IPValuation Partners, LLC)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Takenaka, Yasuji
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): Nguyen, Thinh T
• Application Number:
  US10/745,764
• Publication Number:
  US 20040135156A1
• Time in Patent Office: 812 Days
• Field of Search: 257/79, 257/80, 257/81, 257/88, 257/93, 257/98
• US Class Current: 257/79
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A semiconductor light emitting device includes an LED chip, a first lead frame on which the LED chip is mounted, a second lead frame electrically connected to the LED chip via a bonding wire, and a resin portion surrounding the circumference of the LED chip, and fastening the first and second lead frames. A metal body is located under the region of the first lead frame where the LED chip is mounted.

Claims

1. A semiconductor light emitting device comprising:

an LED chip,

a first lead frame on which said LED chip is mounted,

a second lead frame electrically connected to said LED chip via a wire, and

a resin portion surrounding a circumference of said LED chip, and fastening said first and second lead frames,

wherein a metal body is located under a region of said first lead frame where said LED chip is mounted, and

wherein the second lead frame has a portion where the wire is connected and the metal body is provided to extend to a region below said portion of the second lead frame.

2. The semiconductor light emitting device according to claim 1, wherein said metal body is spaced apart from said first and second lead frames.

3. The semiconductor light emitting device according to claim 1, wherein said metal body forms thermal and electrical contact with said first lead frame.

4. The semiconductor light emitting device according to claim 1, wherein

said metal body has a surface subjected to an electrical insulating process, and

said surface of said metal body subjected to said electrical insulating process forms physical contact with said first lead frame.

5. The semiconductor light emitting device according to claim 1, comprising a plurality of LED chips.

6. The semiconductor light emitting device according to claim 1, wherein said metal body includes at least one type of material selected from the group consisting of copper, aluminum, copper alloy, and aluminum alloy.

7. A semiconductor light emitting device comprising:

an LED chip,

a metal body on which said LED chip is mounted,

a first lead frame electrically connected to said metal body,

a second lead frame electrically connected to said LED chip via a wire, and

a resin portion surrounding a circumference of said metal body and said LED chip, and fastening said first and second lead frames, and

wherein the second lead frame has a portion where the wire is connected and the metal body is provided to extend to a region below said portion of the second lead frame.

9. The semiconductor light emitting device according to claim 7, wherein said metal body includes at least one type of material selected from the group consisting of copper, aluminum, copper alloy, and aluminum alloy.

8. A semiconductor light emitting device comprising:

an LED chip,

a metal body on which said LED chip is mounted,

a first lead frame electrically connected to said metal body,

a second lead frame electrically connected to said LED chip via a wire, and

a resin portion surrounding a circumference of said metal body and said LED chip, and fastening said first and second lead frames.

wherein

said metal body has a top portion worked in an upside down conical-frustum configuration, and

said top portion is fitted in said first lead frame.