Radiating structural body of electronic part and radiating sheet used for the radiating structural body

• US 7,016,196 B2
• Filed: 03/20/2002
• Issued: 03/21/2006
• Est. Priority Date: 04/06/2001
• Status: Expired due to Fees

• Current Assignee: Shin-Etsu Chemical Company Limited
• Original Assignee: Shin-Etsu Chemical Company Limited
• Inventors: Tomaru, Kazuhiko, Mita, Kunihiko, Yoneyama, Tsutomu
• Primary Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US10/250,686
• Publication Number:
  US 20040057206A1
• Time in Patent Office: 1,462 Days
• Field of Search: 361683-687, 361690-697, 361702-719, 174/16.3, 174/52.4, 174/138.G, 174/252, 257/666, 257/678, 257/687, 257707-713, 257/718, 257/737, 165/80.2, 165/80.3, 165/80.4, 165/104.19, 165/84, 165/185, 156/89.24, 156/250, 156/247, 156/89.23, 156/346, 428/40.1, 428/40.4, 428/343, 428/118, 428/34.9, 428/209, 428/220, 428/551, 29827-846, 298/55, 526/320, 526/328, 526/328.5, 524/404, 524/430, 524/443, 524/493, 524/496, 524/588
• US Class Current: 361/702
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/4275 by melting or evaporation of solids
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 428/12049 Nonmetal component
• CPC Class Codes: Y10T 428/14 Layer or component removable to expose adhesive
• CPC Class Codes: Y10T 428/1414 Ceramic, glass, glasslike, vitreous

Abstract

A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.

Claims

1. A heat dissipating structure for a heat generating electronic component, comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion, stacked on said metal sheet, between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member, wherein said heat conductive member having adhesion is formed of a heat conductive composition comprising at least one resin component selected from the group consisting of pressure sensitive adhesive siloxane polymers, a heat conductive filler, and a phase transition material or thermosoftening material selected from the group consisting of silicone resins, the composition having a plasticity at 25°

C. in the range of 100 to 1,000, as measured by JIS K-6249, and being able to phase change or soften by the heat from the electronic component during operation.

2. The heat dissipating structure of claim 1 wherein the metal sheet is an aluminum sheet or copper sheet.

4. The heat dissipating structure of claim 1, wherein the phase transition or thermosoftening material is present in an amount of 10 to 1,000 parts by weight, per 100 parts by weight of the resin component, and the heat conductive filler is present in an amount of 100 to 3,000 parts by weight, per 100 parts by weight of the resin component.

5. The heat dissipating structure of claim 1, wherein the phase transition or thermosoftening material is present in an amount of 50 to 500 parts by weight, per 100 parts by weight of the resin component, and the heat conductive filler is present in an amount of 100 to 2,000 parts by weight, per 100 parts by weight of the resin component.

6. The heat dissipating structure of claim 1, wherein the metal sheet has a thickness of 3 to 200 μ

m.

7. The heat dissipating structure of claim 1, wherein the metal sheet has a thickness of 5 to 75 μ

m.

8. The heat dissipating structure of claim 1, wherein the phase transition or thermosoftening material has an endothermic peak associated with phase change or thermosoftening as measured by a differential scanning calorimeter in the range of 35 to 120°

C.

9. The heat dissipating structure of claim 8, wherein the phase transition or thermosoftening material has an endothermic peak associated with phase change or thermosoftening as measured by a differential scanning calorimeter in the range of 40 to 100°

C.

10. The heat dissipating structure of claim 9, wherein the phase transition or thermosoftening material has an endothermic peak associated with phase change or thermosoftening as measured by a differential scanning calorimeter in the range of 50 to 80°

C.

11. The heat dissipating structure of claim 1, wherein the heat conductive filler is present and has an average particle size in the range of 0.1 to 30 μ

m, and a maximum particle size of up to 100 μ

m.

12. The heat dissipating structure of claim 11, wherein the heat conductive member has a thickness ranging from a value equal to the maximum particle size of the heat conductive filler to an approximate 5 fold.

13. The heat dissipating structure of claim 1, wherein the heat conductive member has a thickness of from 0.1 to 1,000 μ

m.

3. A heat dissipating sheet adapted to be interposed between a heat generating electronic component and a heat dissipating member, comprising a metal sheet adapted to be disposed on the side of the heat generating electronic component and a heat conductive member having adhesion, stacked on the metal sheet and adapted to be disposed on the side of the heat dissipating member, wherein the heat conductive member having adhesion is formed of a heat conductive composition comprising at least one resin component selected from the group consisting of pressure sensitive adhesive siloxane polymers, a heat conductive filler, and a phase transition material or thermosoftening material selected from the group consisting of silicone resins, the composition having a plasticity at 25°

C. in the range of 100 to 1,000, as measured by JIS K-6249, and being able to phase change or soften by the heat from the electronic component during operation.