Stacked chip connection using stand off stitch bonding

  • US 7,021,520 B2
  • Filed: 12/05/2001
  • Issued: 04/04/2006
  • Est. Priority Date: 12/05/2001
  • Status: Active Grant
First Claim
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1. A wire bonded structure comprising:

  • a first bonding area, a second bonding area and a third bonding area respectively provided on first, second, and third components;

    a first wire bond between said first and said second bonding areas;

    a second wire bond between said second and said third bonding areas, wherein a bump is at one end of each of said first and second wire bonds; and

    at least one of said first and second wire bonds at said second bonding area being on top of the other of said first and second wire bond at said second bonding area, and wherein one of said bumps is formed on said second bonding area in electrical communication with said first and second wire bonds.

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