IC card
First Claim
1. A memory card comprising:
- a card substrate having a front surface and a back surface opposed to said front surface;
a plurality of connecting pads formed over said front surface;
a memory chip formed over said front surface;
a controller chip for said memory chip formed over said front surface;
a plurality of test terminals formed over said front surface, andwherein said controller chip, said memory chip and a part of said connecting pads are molded by resin,wherein, in a memory card inserting direction, said connecting pads, said controller chip, said memory chip and said test terminals are arranged over said front surface in order of said connecting pads, said controller chip, said memory chip, and said test terminals, respectively.
2 Assignments
0 Petitions
Accused Products
Abstract
An IC card has a card substrate having semiconductor integrated circuit chips mounted thereon and a plurality of connector terminals formed thereon. The connector terminals are exposed from a casing. The connector terminals are laid out in plural sequences in staggered form between sequences adjacent to one another forward and backward as viewed in an IC card inserting direction. Owing to the adoption of the staggered layout, a structure or configuration wherein the amounts of protrusions of socket terminals of a card socket are changed and the socket terminals are laid out in tandem, can be adopted with relative ease. If a connector terminal arrangement of a downward or low-order IC card is adopted as a specific connector terminal sequence as it is, whereas a function dedicated for an upward or high-order IC card is assigned to another staggered connector terminal arrangement, then backward compatibility can also be implemented with ease.
80 Citations
32 Claims
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1. A memory card comprising:
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a card substrate having a front surface and a back surface opposed to said front surface; a plurality of connecting pads formed over said front surface; a memory chip formed over said front surface; a controller chip for said memory chip formed over said front surface; a plurality of test terminals formed over said front surface, and wherein said controller chip, said memory chip and a part of said connecting pads are molded by resin, wherein, in a memory card inserting direction, said connecting pads, said controller chip, said memory chip and said test terminals are arranged over said front surface in order of said connecting pads, said controller chip, said memory chip, and said test terminals, respectively. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A memory card comprising:
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a substrate having a front surface and a back surface opposed to said front surface; a plurality of connecting pads arranged over said front surface; a first flash memory chip mounted over said front surface; a controller chip for said first flash memory chip mounted over said front surface and electrically connected to said connecting pads; a plurality of first terminals arranged over said front surface and electrically connected to said first flash memory chip; a plurality of second terminals arranged over said back surface and electrically connected to said connecting pads; and a mold resin covering said first flash memory chip and said controller chip, wherein, in a memory card inserting direction, said connecting pads, said controller chip, said first flash memory chip and said first terminals are arranged in order of said connecting pads, said controller chip, said first flash memory chip, and said first terminals, respectively. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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Specification