Probe device for electrical testing an integrated circuit device and probe card using the same

• US 7,053,636 B2
• Filed: 05/25/2004
• Issued: 05/30/2006
• Est. Priority Date: 03/10/2004
• Status: Expired due to Fees

• Current Assignee: Mpi Corporation
• Original Assignee: MJC Probe Incorporation
• Inventors: Sudin, Hendra
• Primary Examiner(s): Nguyen, Vinh
• Assistant Examiner(s): Chan, Emily Y
• Application Number:
  US10/709,723
• Publication Number:
  US 20050200375A1
• Time in Patent Office: 735 Days
• Field of Search: 324/1, 324750-765
• US Class Current: 324/755.05
• CPC Class Codes: G01R 1/06722 Spring-loaded
• CPC Class Codes: G01R 1/06733 Geometry aspects G01R1/06727 takes precedence
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735

Abstract

The present probe device comprises an insulative body, at least one supporter positioned in the insulative body, a probe positioned substantially at the center of the supporter, and a conductive wire positioned in the insulative body and electrically connected to the supporter. The supporter can be a helical spring, which connects to the probe with its inner end and to the insulative body with its outer end. In addition, the supporter may include a plurality of beams, which connects to the probe at one end and to the insulative body at the other end. The beams are positioned in a radial manner with the probe at the center, and the included angle between two adjacent beams is substantially the same. The supporter can further comprise at least one ring connecting the plurality of beams.

Claims

1. A probe device for electrical testing an integrated circuit device, the probe device comprising:

an insulative body including at least one opening;

two supporters positioned substantially in parallel with each other inside the at least one opening of the insulative body, wherein the supporter comprises a helical spring with a spiral coil extending substantially in a same plane;

a probe positioned substantially at a center of the supporter;

wherein the probe is arranged to electrically connect to a pad of the integrated circuit device during testing; and

a conductive wire positioned in the insulative body and electrically connected to the supporter.

2. The probe device of claim 1, wherein the probe and the supporter each comprise a material selected from the group consisting of copper, nickel, cobalt, tin, boron, phosphorus, chromium, tungsten, molybdenum, bismuth, indium, cesium, antimony, gold, silver, rhodium, palladium, platinum, ruthenium and their alloys.

3. The probe device of claim 1, wherein the at least one opening is hexagonal.

4. A probe card for electrical testing an integrated circuit device, the probe card comprising:

a circuit board having at least one test-connecting site;

a probe head having a plurality of probe devices arranged to electrically connect to pads of the integrated circuit device when testing, wherein each of the probe devices comprises;

an insulative body including at least one opening;

two supporters positioned substantially in parallel with each other inside the at least one opening of the insulative body, wherein the supporter comprises a helical spring with a spiral coil extending substantially in a same plane;

a probe positioned substantially at a center of the supporter;

a conductive wire positioned in the insulative body and electrically connected to the supporter; and

an interface board, comprising;

at least one first signal-connecting site positioned on an upper surface of the interface board for electrically connecting the test-connecting site of the circuit board; and

at least one second signal-connecting site positioned on a bottom surface of the interface board for electrically connecting the conductive wire of the probe head.

5. The probe card of claim 4, wherein the probe and the supporter each comprises a material selected from the group consisting of copper, nickel, cobalt, tin, boron, phosphorus, chromium, tungsten, molybdenum, bismuth, indium, cesium, antimony, gold, silver, rhodium, palladium, platinum, ruthenium and their alloys.

6. A probe card for electrical testing an integrated circuit device, the probe card comprising:

a circuit board, comprising;

a plurality of test-connecting sites; and

a plurality of conductive paths for connecting the test-connecting sites to the bottom surface of the circuit board; and

a probe head comprising a plurality of probe devices, wherein each of the plurality of probe devices comprises;

an insulative body including at least one opening;

two supporters positioned substantially in parallel with each other inside the at least one opening of the insulative body, wherein the supporter comprises a helical spring having a spiral coil extending substantially in a same plane;

a probe positioned substantially at a center of the supporter; and

a conductive wire positioned in the insulative body and electrically connected to the supporter and an associated conductive path of the circuit board.