Electronic package having integrated cooling element with clearance for engaging package

• US 7,064,429 B2
• Filed: 06/20/2002
• Issued: 06/20/2006
• Est. Priority Date: 06/20/2001
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Bemmerl, Thomas, Waidhas, Bernd, Wörner, Holger
• Primary Examiner(s): MENZ, LAURA MARY
• Application Number:
  US10/177,947
• Publication Number:
  US 20020195701A1
• Time in Patent Office: 1,461 Days
• Field of Search: 257/706, 257712-722
• US Class Current: 257/713
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/18301 being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

An electronic component includes at least one semiconductor chip. The semiconductor chip is attached on a first side of a wiring board or a leadframe. The wiring board is provided with interconnect structures at least on a second side. The first side of the wiring board, with the semiconductor chip located on it, is completely enclosed by a package. The package is provided with a cooling element, which is an integral part of the package. The invention also relates to a method for producing the electronic component.

Claims

1. An electronic component, comprising:

a semiconductor chip having an active front side and a passive rear side without semiconductor structures;

a wiring board having a first side connected by soldering connections to said active front side of said semiconductor chip and having interconnect structures at least on a second side facing away from said semiconductor chip;

a package completely enclosing said first side of said wiring board;

a cooling element having a central area and clearances with a straight-sided V-shaped funnel cross section widening in an upward direction formed therein and being integrated in said package, said central area thickening and reaching toward said semiconductor chip, said package being form-lockingly engaged by a dovetail connection in said clearances; and

a connecting layer connecting said central area of said cooling element and said passive rear side of said semiconductor chip so that said central area of said cooling element is not separated from said semiconductor chip by material of said package.

2. The electronic component according to claim 1, wherein said wiring board is a leadframe.

4. The electronic component according to claim 1, wherein said cooling element is a metal plate.

5. The electronic component according to claim 1, wherein said clearances have a round contour.

6. The electronic component according to claim 1, wherein:

said cooling element has a side length; and

said clearances have a diameter sized from 3 to 15% of said side length of the cooling element.

7. The electronic component according to claim 1, wherein said clearances are formed by etching.

8. The electronic component according to claim 1, wherein said clearances are formed by laser drilling.

9. The electronic component according to claim 1, wherein said clearances are formed by punching.

10. The electronic component according to claim 1, wherein said package is a plastic package.

11. The electronic component according claim 1, wherein said package is an injection-molded plastic package.

12. The electronic component according to claim 1, including a further semiconductor chip;

said cooling element having a matrix structure with a plurality of surface-area portions each covering a respective semiconductor chip and separating joints subdividing neighboring surface-area portions.

23. The electronic component according to claim 1, wherein said connecting layer directly connects said cooling element and said passive rear side of said semiconductor chip.

3. An electronic component, comprising:

a semiconductor chip having an active front side and a passive rear side without semiconductor structures;

a wiring board having a first side connected by soldering connections to said passive rear side of said semiconductor chip and having interconnect structures at least on a second side facing away from said semiconductor chip;

a package completely enclosing said first side of said wiring board;

a cooling element having a central area and clearances with a straight-sided v-shaped funnel cross section widening in an upward direction formed therein and being integrated in said package, said central area thickening and reaching toward said semiconductor chip, said package being form-lockingly engaged by a dovetail connection in said clearances; and

a connecting layer connecting said central area of said cooling element and said active front side of said semiconductor chip so that said central area of said cooling element is not separated from said semiconductor chip by material of said package.

13. A method for producing an electronic component, which comprises;

providing a semiconductor chip having an active front side and a passive rear side without semiconductor structures;

providing a wiring board having a first side and a second side facing away from the semiconductor chip, the second side having interconnect structures formed thereon;

mounting the semiconductor chip to the wiring board by connecting the first side of the wiring board to the active front side of the semiconductor chip by soldering connections;

applying a package to the semiconductor chip and the wiring board to completely enclose the first side of the wiring board;

integrating a cooling element to the package, the cooling element having a central area and clearances with a straight-sided V-shaped funnel cross section widening in an upward direction formed therein, the central area thickening and reaching toward the semiconductor chip, the package being form-lockingly engaged by a dovetail connection in the clearances; and

providing a connecting layer connecting the central area of the cooling element and the passive rear side of the semiconductor chip so that the central area of the cooling element is not separated from the semiconductor chip by material of the package.

14. The method according to claim 13, which further comprises using a leadframe as the wiring board.

15. The method according to claim 13, which further comprises applying a plurality of semiconductor chips to the wiring board.

16. The method according to claim 15, which further comprises separating the wiring board into individual electronic components after applying the package and the cooling element.

17. The method according to claim 13, which further comprises producing the package from plastic by transfer molding.

18. The method according to claim 17, which further comprises:

attaching the cooling element to one part of a mold having an upper mold part and a lower mold part; and

separating the cooling element from the mold after the transfer molding step.

19. The method according to claim 18, which further comprises sealing the cooling element from the mold with a film.

20. The method according to claim 13, which further comprises:

providing sawing track regions on the wiring board;

providing separating joints in the cooling element; and

disposing congruently the track regions on the separating joints.

21. The method according to claim 18, which further comprises:

providing the cooling element with cooling areas and a frame surrounding the frame;

connecting the frame to the cooling areas by thin webs;

clamping the cooling element in the mold between the upper mold part and lower mold part.

22. The method according to claim 21, which further comprises:

removing the cooling element from the mold after molding; and

severing the thin webs and the frame after the removing from the mold.

24. An electronic component, comprising:

a semiconductor chip having an active front side and a passive rear side without semiconductor structures;

a wiring board having a first side connected by soldering connections to said active front side of said semiconductor chip and having interconnect structures at least on a second side facing away from said semiconductor chip;

a plastic package completely enclosing said first side of said wiring board;

a cooling element having a central area and clearances with a funnel-shaped cross section widening in an upward direction formed therein and being integrated in said package, said central area thickening and reaching toward said semiconductor chip, said package being form-lockingly engaged by a dovetail connection in said clearances; and

a connecting layer connecting said central area of said cooling element and said passive rear side of said semiconductor chip so that said central area of said cooling element is not separated from said semiconductor chip by plastic material of said plastic package.