Integrated circuit heat pipe heat spreader with through mounting holes

CAFC
  • US 7,066,240 B2
  • Filed: 05/09/2001
  • Issued: 06/27/2006
  • Est. Priority Date: 05/12/1999
  • Status: Expired due to Term
First Claim
Patent Images

1. A heat pipe for spreading heat comprising:

  • a boundary structure including spaced-apart first and second plates that define an enclosed vapor chamber;

    at least one depression formed in said first plate which projects into said vapor chamber and is sealingly bonded to said second plate so as to form a bonded region;

    an opening defined through said bonded region wherein the perimeter of said opening is defined within a portion of said bonded region such that said opening is isolated from said vapor chamber; and

    at least one depression formed in said second plate which projects into said vapor chamber and is sealingly bonded to said first plate.

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