High Q factor integrated circuit inductor

• US 7,068,138 B2
• Filed: 01/29/2004
• Issued: 06/27/2006
• Est. Priority Date: 01/29/2004
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Stein, Kenneth J., Cotte, John M., Edelstein, Daniel C., Petrarca, Kevin S., Deligianni, Hariklia, Volant, Richard P., Magerlein, John H., Andricacos, Panayotis C.
• Primary Examiner(s): Abraham, Fetsum
• Application Number:
  US10/768,773
• Publication Number:
  US 20050167780A1
• Time in Patent Office: 880 Days
• Field of Search: 257/758, 257/760, 257/762
• US Class Current: 336/200
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05007 comprising a core and a coating
• CPC Class Codes: H01L 2224/05014 being square
• CPC Class Codes: H01L 2224/05022 the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05027 the internal layer extending out of an opening
• CPC Class Codes: H01L 2224/0508 being stacked
• CPC Class Codes: H01L 2224/05084 Four-layer arrangements
• CPC Class Codes: H01L 2224/05555 being circular or elliptic
• CPC Class Codes: H01L 2224/05557 comprising protrusions or indentations
• CPC Class Codes: H01L 2224/05558 conformal layer on a patterned surface
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13007 Bump connector smaller than the underlying bonding area, e.g. than the under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/13022 the bump connector being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/13023 the whole bump connector protruding from the surface
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48624 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48644 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48724 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48744 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 23/5227 : Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/53238 : Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/12 : Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 27/08 : including only semiconductor components of a single kind
• CPC Class Codes: H01L 28/10 : Inductors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01073 : Tantalum [Ta]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/04953 : TaN
• CPC Class Codes: H01L 2924/05042 : Si3N4
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/30107 : Inductance

Abstract

An inductor and a method of forming and the inductor, the method including: (a) providing a semiconductor substrate; (b) forming a dielectric layer on a top surface of the substrate; (c) forming a lower trench in the dielectric layer; (d) forming a resist layer on a top surface of the dielectric layer; (e) forming an upper trench in the resist layer, the upper trench aligned to the lower trench, a bottom of the upper trench open to the lower trench; and (f) completely filling the lower trench at least partially filling the upper trench with a conductor in order to form the inductor. The inductor including a top surface, a bottom surface and sidewalls, a lower portion of said inductor extending a fixed distance into a dielectric layer formed on a semiconductor substrate and an upper portion extending above said dielectric layer; and means to electrically contact said inductor.

Claims

1. A semiconductor structure, comprising:

an inductor having a top surface, a bottom surface and sidewalls, a lower portion of said inductor extending into but not completely through a single dielectric layer on a semiconductor substrate and an upper portion of said inductor extending above said dielectric layer, said lower portion of said inductor comprising a conductive liner and a core conductor and said upper portion of said inductor consisting only of said core conductor; and

means to electrically contact said inductor.

2. The structure of claim 1, wherein said upper portion further comprises a conductive passivation layer on a top surface and sidewalls of said upper portion of said inductor.

3. The structure of claim 1, wherein said inductor has a height defined by said sidewalls of greater than about 5 microns.

4. The structure of claim 1, wherein said inductor extends parallel to a top surface of said dielectric layer in a spiral coil.

5. The structure of claim 4, wherein said inductor is about 2 to 30 microns wide and adjacent coils of said spiral coil are spaced apart about 2 to 20 microns.

6. The structure of claim 1, wherein said inductor has an inductance of greater than about 0.5 nH.

7. The structure of claim 1, wherein said inductor has a Q factor at greater than about 25.

8. The structure of claim 1, wherein said inductor has a Q factor of greater than about 40.

9. The structure of claim 1, further including:

an I/O terminal pad formed in said substrate; and

a raised contact pad in electrical contact with said I/O terminal pad, said raised contact pad having a top surface, a bottom surface and sidewalls, a lower portion of said inductor extending said fixed distance into said dielectric layer formed on a semiconductor substrata and an upper portion extending above said dielectric layer.

10. The structure of claim 9, wherein said lower portion of said raised contact pad comprises a conductive liner and a core conductor and said upper portion of said raised contact pad comprises said core conductor.

11. The structure of claim 10, wherein said core conductor is Cu and said liner comprises a dual layer of TaN and Ta.

12. The structure of claim 10, wherein said upper portion further comprises a Conductive passivation layer on said top surface and sidewalls of said upper portion of said raised contact pad.

13. The structure of claim 12, wherein said passivation layer comprises layer of Ni or a layer of Au over a layer of Ni.

14. The structure of claim 13, further including an Al or Au wire conductively bonded to said raised contact pad.

15. The structure of claim 13 further including a layer of pad limiting metallurgy on said passivation layer and a solder ball on said pad limiting metallurgy.

16. The structure of claim 15, wherein said pad limiting metallurgy comprises one or more layers selected from the group consisting of Cr layers, CrCu layers, Au layers, Cu layers and TiW layers and said solder ball comprises Pb or Pb/Sn alloy.

17. The structure of claim 9, wherein said top surface of said inductor is in a different plane than a top surface of said raised contact pad.

18. The structure of claim 9, wherein a top surface of said inductor is higher than said top surface of said raised contact pad relative to a top surface of said dielectric layer.

19. A structure, comprising:

and inductor having a top surface, a bottom surface and sidewalls, a lower portion of said inductor extending into but not completely through a single dielectric layer on a semiconductor substrate and an upper portion of said inductor extending above said dielectric layer, said lower portion of said inductor comprising a conductive liner and a core conductor and said upper portion of said inductor consists only of said core conductor, said core conductor comprising Cu and said liner comprising a dual layer of TaN and Ta.

20. A structure comprising:

an inductor having a top surface, a bottom surface and sidewalls, a lower portion of said inductor extending into but not completely through a single dielectric layer on a semiconductor substrate and an upper portion of said inductor extending above said dielectric layer, said lower portion of said inductor comprising a conductive liner and a core conductor and said upper portion of said inductor consisting only of said core conductor; and

a conductive passivation layer on a top surface and sidewalls of said upper portion of said inductor, said passivation comprising layer a layer of Ni or a layer of Au over a layer of Ni.

21. A structure, comprising:

an inductor having a top surface, a bottom surface and sidewalls, a lower portion of said inductor extending into but not completely through a single dielectric layer on a semiconductor substrate and an upper portion of said inductor extending above said dielectric layer, said lower portion extending a distance of less than 3 microns into said dielectric layer.

22. A structure, comprising:

an inductor having a top surface, a bottom surface and sidewalls, a lower portion of said inductor extending into but not completely through a single dielectric layer on a semiconductor substrate and upper portion of said inductor extending above said dielectric layer; and

integral vias extending from said bottom surface of said inductor through said dielectric layer and electrically contacting pass through metallurgy in said substrate.

23. The structure claim 22, wherein said top surface of said inductor over said vias is closer to a top surface of said dielectric layer than portions of said top surface of said inductor not over said vias.

24. A structure, comprising:

an inductor having a top surface, a bottom surface and sidewalls, a lower portion of said inductor extending into but not completely through a single dielectric layer on a semiconductor substrate and an upper portion of said inductor extending above said dielectric layer;

means to electrically contact said inductor; and

a contact pad comprising a via formed in said dielectric layer, said via exposing at least a portion of an I/O terminal pad in said substrate, sidewalls of said via and at least a portion of said I/O terminal pad covered with a passivation layer over a conformal seed layer over a conductive liner.

25. The structure of claim 24, wherein said conductive liner comprises a dual layer of TaN and Ta, said seed layer comprises Cu and said passivation layer comprises a layer of Ni or a layer of Au over a layer of Ni.

26. The structure of claim 25, further including an Al or Au wire conductively bonded to said contact pad.

27. The structure of claim 25 further including a layer of pad limiting metallurgy on said passivation layer and a solder ball on said pad limiting metallurgy.

28. The structure of claim 27, wherein said pad limiting metallurgy comprises one or more layers selected from the group consisting of Cr layers, CrCu layers, Au layers, Cu layers and TiW layers and said solder ball comprises Pb or Pb/Sn alloy.

29. The structure of claim 24, wherein said top surface of said inductor is in a different plane than a top surface of said contact pad.

30. The structure of claim 24, wherein a top surface of said inductor is higher than said top surface of said contact pad relative to a top surface of said dielectric layer.