Methods for fabricating final substrates
First Claim
1. A method of fabricating a final substrate for use in optics, electronics, or optoelectronics which comprises:
- forming a zone of weakness beneath a surface of a source substrate to define a transfer layer;
detaching the transfer layer from the source substrate along the zone of weakness;
depositing a useful layer upon the transfer layer;
transferring the transfer layer onto an intermediate support; and
depositing a support material on the useful layer after the transfer layer is transferred onto the intermediate support to form the final substrate, wherein the useful layer is deposited on the transfer layer after detaching the transfer layer from the source substrate.
0 Assignments
0 Petitions
Accused Products
Abstract
Methods for fabricating final substrates for use in optics, electronics, or optoelectronics are described. The method includes forming a zone of weakness beneath a surface of a source substrate to define a transfer layer; detaching the transfer layer from the source substrate along the zone of weakness; depositing a useful layer upon the transfer layer; and depositing a support material on the useful layer to form the final substrate. The useful layer may be deposited on the transfer layer before or after detaching the transfer layer from the source substrate. The useful layer is typically made of a material having a large band gap, and comprises at least one of gallium nitride, or aluminum nitride, or of compounds of at least two elements including at least one element of aluminum, indium, and gallium. The zone of weakness may advantageously be formed by implanting atomic species into the source substrate.
26 Citations
19 Claims
-
1. A method of fabricating a final substrate for use in optics, electronics, or optoelectronics which comprises:
- forming a zone of weakness beneath a surface of a source substrate to define a transfer layer;
detaching the transfer layer from the source substrate along the zone of weakness;
depositing a useful layer upon the transfer layer;
transferring the transfer layer onto an intermediate support; and
depositing a support material on the useful layer after the transfer layer is transferred onto the intermediate support to form the final substrate, wherein the useful layer is deposited on the transfer layer after detaching the transfer layer from the source substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
- forming a zone of weakness beneath a surface of a source substrate to define a transfer layer;
-
12. A method of fabricating a final substrate for use in optics, electronics, or optoelectronics which comprises:
- forming a zone of weakness beneath a surface of a source substrate to define a transfer layer;
detaching the transfer layer from the source substrate along the zone of weakness;
depositing a useful layer upon the transfer layer;
transferring the transfer layer onto an intermediate support; and
depositing a support material on the useful layer after the transfer layer is transferred onto the intermediate support to form the final substrate, wherein the intermediate support includes a plurality of transfer layers.
- forming a zone of weakness beneath a surface of a source substrate to define a transfer layer;
-
13. A method of fabricating a final substrate for use in optics, electronics, or optoelectronics which comprises:
- forming a zone of weakness beneath a surface of a source substrate to define a transfer layer;
detaching the transfer layer from the source substrate along the zone of weakness;
depositing a useful layer upon the transfer layer;
transferring the transfer layer onto an intermediate support; and
depositing a support material on the useful layer after the transfer layer is transferred onto the intermediate support to form the final substrate, and eliminating the intermediate support so that it is not present in the final substrate. - View Dependent Claims (14)
- forming a zone of weakness beneath a surface of a source substrate to define a transfer layer;
-
15. A method of fabricating a final substrate for use in optics, electronics, or optoelectronics which comprises:
- forming a zone of weakness beneath a surface of a source substrate to define a transfer layer;
detaching the transfer layer from the source substrate along the zone of weakness;
depositing a useful layer upon the transfer layer;
forming a bonding layer on the intermediate support or the transfer layer;
subsequently transferring the transfer layer onto an intermediate support; and
depositing a support material on the useful layer after the transfer layer is transferred onto the intermediate support to form the final substrate. - View Dependent Claims (16, 17, 18, 19)
- forming a zone of weakness beneath a surface of a source substrate to define a transfer layer;
Specification