Encapsulated light receiving and processing semiconductor module with enhanced shielding and grounding properties

• US 7,071,523 B2
• Filed: 07/27/2004
• Issued: 07/04/2006
• Est. Priority Date: 07/28/2003
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Kumura, Naoki, Yamasaki, Tetsuya, Yano, Shinji
• Primary Examiner(s): Lee, Eddie
• Assistant Examiner(s): ARENA, ANDREW OWENS
• Application Number:
  US10/901,006
• Publication Number:
  US 20050073018A1
• Time in Patent Office: 707 Days
• Field of Search: 257/433
• US Class Current: 257/433
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02164 for shielding light, e.g. light blocking layers, cold shields for infrared detectors
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device

Abstract

A semiconductor module that includes a resin package having a first surface and a second surface which is different from the first surface. A lead includes an inner portion covered by the resin package and an outer portion projecting from the first surface of the resin package. A semiconductor element is mounted to the inner portion of the lead and is covered by the resin package. A conductive film, provided separately from the lead, covers at least the second surface of the resin package, with the conductive film provided with a connecting portion held in contact with the outer portion of the lead at the first surface of the resin package. The inner portion of the lead includes an extension extending toward the second surface of the resin package the extension being held in contact with the conductive film at the second surface of the resin package.

Claims

1. A semiconductor module comprising:

a resin package including a first surface, and a second surface which is different from the first surface;

a lead including an inner portion covered by the resin package and an outer portion projecting from the first surface of the resin package;

a semiconductor element mounted to the inner portion of the lead and covered by the resin package; and

a conductive film provided separately from the lead for covering at least the second surface of the resin package, the conductive film being provided with a connecting portion held in contact with the outer portion of the lead at the first surface of the resin package;

wherein the inner portion of the lead includes an extension extending toward the second surface of the resin package, the extension being held in contact with the conductive film at the second surface of the resin package;

wherein the resin package further includes a third surface extending between the first and second surfaces of the resin package, and a fourth surface opposite to the third surface;

wherein the inner portion of the lead further includes a second extension extending toward the third surface of the resin package, and a third extension extending toward the fourth surface of the resin package;

wherein the second extension is held in contact with the conductive film at the third surface of the resin package; and

wherein the third extension is held in contact with the conductive film at the fourth surface of the resin package.

2. The module according to claim 1, wherein the extension projects from the second surface of the resin package.

3. The module according to claim 1, wherein the semiconductor element comprises a light receiving element having a light receiving surface, the light receiving surface being formed with a mesh-like conductor pattern.

4. The module according to claim 3, wherein the resin package includes a lens surface for converging light onto the light receiving element, and wherein the conductive film has light shielding property.

5. A semiconductor module comprising:

a resin package including a first surface, and a second surface which is different from the first surface;

a lead including an inner portion covered by the resin package and an outer portion projecting from the first surface of the resin package;

a semiconductor element mounted to the inner portion of the lead and covered by the resin package; and

a conductive film provided separately from the lead for covering at least the second surface of the resin package, the conductive film being provided with a connecting portion held in contact with the outer portion of the lead at the first surface of the resin package;

wherein the inner portion of the lead includes an extension extending toward the second surface of the resin package, the extension being held in contact with the conductive film at the second surface of the resin package; and

wherein the inner portion of the lead is formed with a recess for accommodating the semiconductor element;

wherein the resin package further includes a third surface extending between the first and second surfaces of the resin package and a fourth surface opposite to the third surface;

wherein the inner portion of the lead further includes a second extension extending toward the third surface of the resin package, and a third extension extending toward the fourth surface of the resin package;

wherein the second extension is held in contact with the conductive film at the third surface of the resin package; and

wherein the third extension is held in contact with the conductive film at the fourth surface of the resin package.

6. The module according to claim 5, wherein the extension projects from the second surface of the resin package.

7. The module according to claim 5, further comprising a connection strip provided on the first surface of the resin package and connected to the conductive film, the connection strip being held in contact with the lead while surrounding the lead.

8. The module according to claim 5, wherein the recess has a depth which is no smaller than a thickness of the semiconductor element.

9. The module according to claim 5, wherein the recess is defined by a bottom portion to which the semiconductor element is mounted and a side wall surrounding the semiconductor element, the side wall being tapered toward the bottom portion.

10. The module according to claim 9, wherein the side wall of the recess includes a reflective surface for reflecting light toward the semiconductor element.

11. The module according to claim 5, further comprising an integrated circuit element for processing a signal outputted from the semiconductor element, and a resin material covering the integrated circuit element, the resin material being covered by the resin package and having light shielding property which is higher than light shielding property of the resin package.

12. A semiconductor module comprising:

a resin package including a first surface, and a second surface which is different from the first surface;

a lead including an inner portion covered by the resin package and an outer portion projecting from the first surface of the resin package;

a semiconductor element mounted to the inner portion of the lead and covered by the resin package; and

a conductive film provided separately from the lead for covering at least the second surface of the resin package, the conductive film being provided with a connecting portion held in contact with the outer portion of the lead at the first surface of the resin package;

wherein the inner portion of the lead includes an extension extending toward the second surface of the resin package, the extension being held in contact with the conductive film at the second surface of the resin package; and

wherein the outer portion of the lead includes an upper surface, a lower surface and two opposite side surfaces, the connecting portion of the conductive film being held in contact with the upper, lower and two side surfaces of the outer portion of the lead.