LED package die having a small footprint

• US 7,078,254 B2
• Filed: 01/13/2005
• Issued: 07/18/2006
• Est. Priority Date: 12/06/2002
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Loh, Ban P.
• Primary Examiner(s): Zarneke, David A.
• Application Number:
  US11/034,598
• Publication Number:
  US 20050145858A1
• Time in Patent Office: 551 Days
• Field of Search: None
• US Class Current: 438/26
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/76 with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A light emitting die package and a method of making the light emitting die package are disclosed. The die package includes a stem substrate having grooves, a wire lead attached to the grooves, and a light emitting diode (LED) mounted on the stem substrate. Also coupled to the substrate are a sleeve, a reflector, and a lens. To make the light emitting die package, a long substrate is formed and wire leads are attached to the substrate. Then, the substrate including the attached wire leads is cut to predetermine lengths to form individual stem substrates. To each stem substrate, LED, reflector, and lens are coupled.

Claims

1. A method of manufacturing a light emitting die package, the method comprising:

fabricating a stem substrate rod having a predetermined length, the stem substrate rod defining at least one groove;

attaching wire lead on the groove of the stem substrate rod;

cutting the stem substrate rod including the attached wire leads to a predetermined length thereby forming an individual stem substrate;

planarizing a first end surface of the individual stem substrate; and

mounting a light emitting diode (LED) on the first end surface, the LED making electrical and thermal contact with the stem substrate, the LED also connected to the wire lead.

2. The method recited in claim 1 further comprising encapsulating the LED.

3. The method recited in claim 1 further comprising attaching a sleeve surrounding the stem substrate proximal to the first end surface, the sleeve defining an opening at the first end surface.

4. The method recited in claim 2 further comprising coupling a reflector on the sleeve, the reflector surrounding the opening.

5. The method recited in claim 2 further comprising coupling a lens to the sleeve, the lens covering the opening.