LED lighting assembly with improved heat management

CAFC
  • US 7,083,305 B2
  • Filed: 05/26/2004
  • Issued: 08/01/2006
  • Est. Priority Date: 12/10/2001
  • Status: Active Grant
First Claim
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1. A light emitting diode assembly comprising:

  • a light emitting diode having a mounting base, said mounting base having a heat transfer plate on a rear surface thereof and a first and second contact lead extending from the sides thereof;

    a mounting die, said mounting die being thermally conductive, said mounting die having a rear wall with a top surface, a bottom surface and two holes extending through said rear wall and a side wall extending upwardly from said top surface of said rear wall, said top surface and said side wall cooperating to form a cavity therein; and

    a circuit board received adjacent said bottom surface of said rear wall of said mounting die, said circuit board having two electrically conductive riser members thereon, said risers extending through said holes in said rear wall,wherein said light emitting diode is received in said cavity with said heat transfer plate in thermal communication with said top surface of said mounting die, said first and second contact leads being positioned above said holes and in electrical communication with said two riser members.

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