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Ultra-high capacitance device based on nanostructures

  • US 7,091,084 B2
  • Filed: 01/26/2005
  • Issued: 08/15/2006
  • Est. Priority Date: 09/20/2002
  • Status: Expired due to Fees
First Claim
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1. A method comprising:

  • providing a substrate;

    forming a lower insulator over said substrate;

    forming a lower conductor over said lower insulator;

    forming a diffusion barrier layer to encapsulate said lower conductor;

    annealing said lower conductor to form a desired grain size;

    forming a conducting nanostructure over said lower conductor, said conducting nanostructure being discontinuous;

    arranging said conducting nanostructure over said lower conductor;

    orienting a longer dimension of said conducting nanostructure;

    forming a thin dielectric over said conducting nanostructure, said thin dielectric being conformal over said conducting nanostructure and said lower conductor;

    forming an upper conductor over said thin dielectric; and

    forming an upper insulator over said upper conductor.

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