Elongated bonding pad for wire bonding and sort probing

  • US 7,091,613 B1
  • Filed: 10/31/2003
  • Issued: 08/15/2006
  • Est. Priority Date: 10/31/2003
  • Status: Expired due to Fees
First Claim
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1. A integrated circuit device, comprising:

  • a semiconductor substrate having an upper surface, electrical components being formed in the semiconductor substrate;

    a plurality of metal layers on top of the upper surface of the substrate, conductive paths defined in the metal layers being connected to the electrical components; and

    a plurality of bonding pads disposed on top of the metal layers and connected thereto such that the electrical components are connected to selected bonding pads through the conductive paths, each bonding pad further comprising;

    a bonding area located above a region where each of the metal layers overlaps; and

    an elongated probing area located above a subset of the plurality of metal layers for receiving a probing pin of a probing card, the elongated probing area being electrically connected to the bonding area.

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