Light emitting diodes packaged for high temperature operation

  • US 7,095,053 B2
  • Filed: 08/11/2003
  • Issued: 08/22/2006
  • Est. Priority Date: 05/05/2003
  • Status: Active Grant
First Claim
Patent Images

1. A packaged LED for high temperature operation comprising:

  • a metal base, the metal base including an underlying thermal connection pad and a pair of underlying electrical connection pads;

    a layer of ceramic overlying the metal base; and

    an LED mounted on the ceramic layer, wherein the LED includes a pair of electrodes electrically connected to respective underlying electrical connection pads, and wherein the LED is thermally coupled to the metal base by one or more thermal vias, and thermally coupled through the metal base to the thermal connection pad.

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