Method of manufacturing an optical device

• US 7,096,579 B2
• Filed: 02/17/2004
• Issued: 08/29/2006
• Est. Priority Date: 11/10/2000
• Status: Expired due to Fees

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Murata, Akihiro
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US10/778,107
• Publication Number:
  US 20040158977A1
• Time in Patent Office: 924 Days
• Field of Search: 295/921, 298/25, 298/32, 445/25
• US Class Current: 29/832
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01S 5/0222 Gas-filled housings
• CPC Class Codes: H01S 5/02234 Resin-filled housings; the housings being made of resin
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: H01S 5/0237 by soldering
• CPC Class Codes: H01S 5/183 having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/53191 Means to apply vacuum directly to position or hold work part

Abstract

The invention provides an optical device having an optical element, a substrate, and a flexible member. A first portion of the flexible member is disposed so as to be spaced from the substrate, a second portion surrounding the first portion is adhered to the substrate, and a closed space is defined between the first portion and the substrate. The optical element is mounted on the substrate within the closed space.

Claims

1. A method of manufacturing an optical device, comprising:

mounting an optical element on a substrate, the substrate having a penetrating hole;

adhering a flexible member to the substrate so as to cover the optical element, to define a closed space between the substrate and the flexible member;

evacuating the closed space through the penetrating hole;

filling the closed space with transparent resin; and

blocking the hole with the transparent resin.