Semiconductor device and hybrid integrated circuit device

• US 7,102,211 B2
• Filed: 06/30/2004
• Issued: 09/05/2006
• Est. Priority Date: 07/01/2003
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Kanto Sanyo Semiconductors Company Limited (Panasonic Holdings Corporation), Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Inventors: Ochiai, Isao, Take, Masato
• Primary Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US10/881,561
• Publication Number:
  US 20050236706A1
• Time in Patent Office: 797 Days
• Field of Search: 257/666, 257/672, 257/674, 257/676, 257/677, 257/E23.049, 438/123, 438/FOR.365, 438/FOR.366, 438/FOR.380, 438/110, 438/111, 613/813
• US Class Current: 257/666
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/49568 specifically adapted to facilitate heat dissipation
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/20754 : larger or equal to 40 microns less than 50 microns
• CPC Class Codes: H05K 1/0203 : Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 2201/10659 : Different types of terminals for the same component, e.g. solder balls combined with leads
• CPC Class Codes: H05K 2201/10689 : Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 3/3426 : characterised by the leads

Abstract

The related arts have difficulty in efficiently dissipating the heat generated by a resin-molded semiconductor element, and thus have the problem of thermal stress causing damage to the semiconductor element. To solve the problem, a semiconductor device of the preferred embodiments includes common leads coupled to an island, and a part of the common leads projects out from a resin seal body. The projecting common leads have a coupling portion. When mounting the semiconductor device, the common leads are bridged with brazing material. Thus, the heat generated by an integrated circuit chip mounted on the island is dissipated through the common leads to the outside of the resin seal body. In the preferred embodiments of the invention, a further improvement in heat dissipation characteristics can be accomplished by increasing the surface areas of the common leads.

Claims

1. A semiconductor device including:

an island on which a semiconductor element is mounted;

a plurality of discrete leads each having an end extending near the island;

a plurality of common leads coupled to the island; and

a resin-sealing body molding the semiconductor element, the island, the discrete leads, and the common leads,

wherein the common leads projecting out from the resin-sealing body are provided with a coupling portion.

2. The semiconductor device according to claim 1, wherein the common leads are bonded to a conductive pattern with a conductive adhesive, and the common leads are bridged with the conductive adhesive between the coupling portion and the conductive pattern.

3. The semiconductor device according to claim 1, wherein the common leads are coupled to both sides of the island.

4. The semiconductor device according to claim 1, wherein the common leads are each formed into a gull-wing shape.

9. The semiconductor device according to claim 1, wherein the coupling portion is formed between a side surface of the resin-sealing body and ends of the common leads.

10. The semiconductor device according to claim 4, wherein the coupling portion is formed on a vertical portion of the gull-wing shape.

5. A hybrid integrated circuit device including:

a conductive pattern formed at least on a surface of a hybrid integrated circuit board;

a semiconductor element or a passive element mounted on the conductive pattern;

a plurality of leads connected to the conductive pattern and extending outside, the leads acting as an output or an input; and

a resin-sealing body made of a thermosetting resin, which coats at least the surface of the board by transfer molding,

wherein the leads have a plurality of common leads projecting out from the resin-sealing body, and the common leads are coupled by a coupling portion.

6. The hybrid integrated circuit device according to claim 5, wherein the common leads are bonded to a conductive pattern with a conductive adhesive, and the common leads are bridged with the conductive adhesive between the coupling portion and the conductive pattern.

7. The hybrid integrated circuit device according to claim 5, wherein the common leads are each formed into a gull-wing shape.

8. The hybrid integrated circuit device according to claim 5, wherein the board is made of a metal board, and has a die-cut surface which is opposite to the surface of the board on which the conductive pattern is formed, and the die-cut surface is located on a side of a rear surface of the resin-sealing body.

11. The hybrid integrated circuit device according to claim 5, wherein the coupling portion is formed between a side surface of the resin-sealing body and ends of the common leads.

12. The hybrid integrated circuit device according to claim 7, wherein the coupling portion is formed on a vertical portion of the gull-wing shape.