Semiconductor device and hybrid integrated circuit device

  • US 7,102,211 B2
  • Filed: 06/30/2004
  • Issued: 09/05/2006
  • Est. Priority Date: 07/01/2003
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor device including:

  • an island on which a semiconductor element is mounted;

    a plurality of discrete leads each having an end extending near the island;

    a plurality of common leads coupled to the island; and

    a resin-sealing body molding the semiconductor element, the island, the discrete leads, and the common leads,wherein the common leads projecting out from the resin-sealing body are provided with a coupling portion.

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