Heat sinks

• US 7,109,520 B2
• Filed: 10/10/2003
• Issued: 09/19/2006
• Est. Priority Date: 10/10/2003
• Status: Active Grant

• Current Assignee: LG Chem Limited (LG Corporation)
• Original Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Inventors: Yu, Gang, Wang, Jian
• Primary Examiner(s): Baumeister, B. William
• Assistant Examiner(s): Farahani, Dana
• Application Number:
  US10/683,829
• Publication Number:
  US 20050077615A1
• Time in Patent Office: 1,075 Days
• Field of Search: 257/706, 257/704, 257/705, 257/707
• US Class Current: 257/40
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H10K 50/87 Arrangements for heating or cooling
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

An aspect of the present invention provides a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a thickness no greater than 9 mm. In another embodiment, a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a ratio of area:thickness, as seen from a plan view, of at least 500:1 when the area and thickness are expressed in units of mm² and mm, respectively.

Claims

1. An organic electronic device comprising a heat sink, wherein:

the heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink;

the heat sink has a thickness no greater than 9 mm; and

the heat sink is attached to an array within the organic electronic device.

2. The organic electronic device of claim 1, wherein at least one side of the heat sink has a pattern that extends partially, but not completely through the heat sink.

3. The organic electronic device of claim 2, wherein the heat sink has a thickness no greater than 500 microns.

4. The organic electronic device of claim 2, wherein the heat sink lies within 90 μ

m of an organic active layer of the organic electronic device.

5. Organic electronic device of claim 2, wherein the side with the pattern has a black surface.

6. The organic electronic device for claim 2, wherein the organic electronic device is designed to be at least one of an outdoor display and a lighting panel.

7. The organic electronic device of claim 1, wherein the side with the pattern is black.

8. An organic electronic device comprising a heat sink, wherein:

the heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink;

the heat sink has a ratio of area;

thickness, as seen from a plan view, of at least 500;

1 when the area and thickness are expressed in units of mm2 and mm, respectively; and

the heat sink is attached to an array within the organic electronic device.

9. The organic electronic device of claim 8, wherein at least one side of the heat sink has a pattern that extends partially, but not completely through the heat sink.

10. The organic electronic device of claim 9, wherein the heat sink has a thickness no greater than 500 microns.

11. The organic electronic device of claim 9, wherein the ratio of area:

thickness is at least 11,000;

1.

12. The organic electronic device of claim 9, wherein the heat sink lies within 90 μ

m of an organic active layer of the organic electronic device.

13. The organic electronic device of claim 12, wherein the organic electronic device is designed to be at least one of an outdoor display and a lighting panel.

14. The organic electronic device of claim 9, wherein the side with the pattern has a black surface.