Method of cleaning a side of a thin flat substrate by applying sonic energy to the opposite side of the substrate

  • US 7,117,876 B2
  • Filed: 12/03/2003
  • Issued: 10/10/2006
  • Est. Priority Date: 09/30/1996
  • Status: Expired due to Fees
First Claim
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1. A method of processing a thin, flat substrate having two generally planar opposite sides, comprising:

  • supporting the substrate in a substantially horizontal orientation;

    positioning a transmitter adjacent to one of the planar sides of the substrate;

    flowing liquid onto both planar sides of the substrate so as to form a meniscus of liquid between the transmitter and the one planar side of the substrate; and

    transmitting sonic energy to the liquid on the one planar side of the substrate via the transmitter so that the sonic energy passes through substrate and to the opposite planar side of the substrate, thereby loosening particles on both planar sides of the substrate while maintaining said substantially horizontal orientation.

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