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Articles of manufacture and wafer processing apparatuses

  • US 7,148,718 B2
  • Filed: 08/03/2004
  • Issued: 12/12/2006
  • Est. Priority Date: 08/21/1998
  • Status: Expired due to Fees
First Claim
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1. An article of manufacture comprising:

  • an electronic device wafer processing intermediate member adapted to receive an electronic device wafer having an electrical coupling and couple with a chuck having an electrical coupling, the intermediate member comprising;

    an electrical interconnect configured to electrically connect the electrical coupling of the electronic device wafer with the electrical coupling of the chuck; and

    wherein the intermediate member is configured to support the electronic device wafer comprising a plurality of integrated circuit dies being fabricated.

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