Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures

• US 7,160,429 B2
• Filed: 05/07/2003
• Issued: 01/09/2007
• Est. Priority Date: 05/07/2002
• Status: Expired due to Term

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Smalley, Dennis R., Cohen, Adam L., Lockard, Michael S., Arat, Vacit, Lee, Christopher J.
• Primary Examiner(s): Wong; Edna
• Application Number:
  US10/434,103
• Publication Number:
  US 20040020782A1
• Time in Patent Office: 1,343 Days
• Field of Search: 205/118, 205/170, 205/220, 205/223
• US Class Current: 205/220
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81C 1/00293 maintaining a controlled atmosphere with processes not provided for in B81C1/00285
• CPC Class Codes: B81C 2203/0145 Hermetically sealing an opening in the lid
• CPC Class Codes: C23C 18/1605 by masking
• CPC Class Codes: C23C 18/1651 Two or more layers only obtained by electroless plating
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: H01P 1/202 Coaxial filters cascaded coaxial cavities H01P1/205
• CPC Class Codes: H01P 11/00 Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
• CPC Class Codes: H01P 11/005 Manufacturing coaxial lines
• CPC Class Codes: H01P 3/06 Coaxial lines
• CPC Class Codes: H01P 5/183 at least one of the guides being a coaxial line
• CPC Class Codes: H05K 3/4647 by applying an insulating layer around previously made via studs

Abstract

In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

Claims

1. An electrochemical fabrication process for producing a three-dimensional structure, comprising a structural component and an enclosure, from a plurality of adhered layers, the process comprising:

(A) depositing at least a portion of a first layer onto a substrate, wherein the substrate may comprise previously deposited material; and

(B) forming a plurality of layers such that a second layer is formed on the first layer and such that each successive layer is formed adjacent to and adhered to a previously formed layer, and wherein the formation of at least some of the plurality of layers comprises an electrochemical deposition or electrochemical etching operation;

wherein the plurality of layers comprise at least three different materials and wherein the layers contain patterns of the at least three different materials comprising;

(1) a desired structural component that is to be protected and that is formed from at least one structural material;

(2) a protective enclosure that is formed at least in part from a structural material, wherein at least one portion of the enclosure at least partially surrounds the desired structural component, and wherein the enclosure is limited by at least one opening therein;

(3) a sealing material located near the at least one opening; and

(4) a sacrificial material located at least partially between the desired structural component to be protected and the at least a portion of the enclosure;

wherein after formation of the layers at least a portion of the sacrificial material located between the desired structural component and the at least a portion of the enclosure is removed; and

wherein after the removal of the sacrificial material, the sealing material is made to temporarily flow and seal the at least one opening to block or significantly limit a passage of material from an outside of the enclosure to an inside of the enclosure via the at least one sealed opening.

2. The process of claim 1 wherein the removal of the sacrificial material comprises an etching operation.

3. The process of claim 1 wherein after removal of the sacrificial material and prior to sealing, a reducing agent is provided to at least one location within or near the at least one opening to reduce the presence of any oxides at the at least one location.

4. The process of claim 1 wherein after removal of the sacrificial material and prior to sealing, a desired fill gas is made to fill an interior cavity of the enclosure in which the desired structural component is at least partially located.

5. The process of claim 1 wherein after removal of the sacrificial material and prior to sealing, an interior cavity of the enclosure in which the desired structural component is at least partially located is at least partially evacuated.

6. The process of claim 1 wherein the at least one opening and the sealing material are located so that the sealing material need not flow over any structural material when flowing to seal the opening.

7. The process of claim 1 wherein the at least one opening is sealed at least in part by a surface tension of the sealing material when made flowable causing the sealing material to bulge and bridge the opening.

8. The process of claim 1 wherein the at least one opening has sloped walls that give the opening a non-fixed cross-sectional dimension through the enclosure, the sealing material, or a combination of the sealing material and the enclosure.

9. The process of claim 1 wherein the at least one opening has a restriction around which the sealing material will flow when sealing the opening.

10. An electrochemical fabrication process for producing a three-dimensional structure, comprising a structural component and an enclosure, from a plurality of adhered layers, the process comprising:

(A) depositing at least a portion of a first layer onto a substrate, wherein the substrate may comprise previously deposited material; and

(B) forming a plurality of layers such that a second layer is formed on the first layer and such that each successive layer is formed adjacent to and adhered to a previously formed layer, and wherein the formation of at least some of the plurality of layers comprises an electrochemical deposition or electrochemical etching operation;

wherein the layers comprise at least two different materials and wherein the layers contain patterns of the at least two different materials comprising;

(1) a desired structural component that is to be protected and that is formed from at least one structural material;

(2) a protective enclosure that is formed at least in part from a structural material, wherein at least a portion of the enclosure at least partially surrounds the desired structural component, and wherein the enclosure is limited by at least one opening therein;

(3) at least one blocking structure located along a line of sight that includes the at least one opening but spaced from the protective enclosure; and

(4) a sacrificial material located at least partially between the desired structural component to be protected and the at least a portion of the enclosure;

wherein after formation of the layers at least a portion of the sacrificial material located between the desired structural component and the at least a portion of the enclosure is removed; and

wherein after the removal of the sacrificial material, a sealing material is deposited such that it strikes said blocking structure which inhibits the sealing material from entering the enclosure in bulk, whereby continued build up of the sealing material seals the at least one opening to block or significantly limit a passage of material from an outside of the enclosure to an inside of the enclosure via the at least one sealed opening.

11. An electrochemical fabrication process for producing a three-dimensional structure, comprising a structural component and an enclosure, from a plurality of adhered layers, the process comprising:

(A) depositing at least a portion of a first layer onto a substrate, wherein the substrate may comprise previously deposited material; and

(B) forming a plurality of layers such that a second layer is formed on the first layer and such that each successive layer is formed adjacent to and adhered to a previously formed layer, and wherein the formation of at least some of the plurality of layers comprises an electrochemical deposition or electrochemical etching operation and further comprising a planarization operation for setting a uniform height of one or more deposited materials;

wherein the plurality of layers comprise at least two different materials and wherein the layers contain patterns of the at least two different materials comprising;

(1) a desired structural component that is to be protected and that is formed from at least one structural material;

(2) a protective enclosure that is formed at least in part from a structural material, wherein at least a portion of the enclosure at least partially surrounds the desired structural component, and wherein the enclosure is limited by at least one opening therein; and

(3) a sacrificial material located at least partially between the desired structural component to be protected and the at least a portion of the enclosure;

wherein after formation of the layers at least a portion of the sacrificial material located between the desired structural component and the at least a portion of the enclosure is removed; and

wherein after the removal of the sacrificial material, a seal is formed to close the at least one opening to block or significantly limit a passage of material from an outside of the enclosure to an inside of the enclosure via the at least one closed opening.