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Lead embedded pressure sensor

  • US 7,162,926 B1
  • Filed: 08/04/2005
  • Issued: 01/16/2007
  • Est. Priority Date: 08/04/2005
  • Status: Active Grant
First Claim
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1. A pressure sensing module comprising:

  • a pressure sensing capsule having;

    a body with a distal end and a proximal end;

    an electrical circuit integrated into the body;

    a first cavity located between the distal end and the proximal end;

    an isolation diaphragm coupled to the distal end of the body of the pressure sensing capsule;

    a MEMS pressure sensor mounted within the first cavity of the body of the pressure sensing capsule; and

    ,a sealed cavity configured to transfer a pressure applied to the isolation diaphragm to the MEMS pressure sensor.

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