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Packaging designs for LEDs

DC
  • US 7,170,100 B2
  • Filed: 08/23/2005
  • Issued: 01/30/2007
  • Est. Priority Date: 01/21/2005
  • Status: Active Grant
First Claim
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1. A system comprising:

  • a substrate;

    an array of light emitting devices supported by the substrate, the array having an outer perimeter that defines an area, the array of light emitting devices being positioned such that a ratio of a sum of a total area of all of the light emitting devices in the array of light emitting devices to the area defined by the outer perimeter is at least about 0.75; and

    a package containing the substrate and the array of light emitting devices, the package having a layer configured so that at least about 75% of the light that emerges from the light emitting devices and impinges on the layer passes through the layer,wherein the layer is disposed such that a distance between a surface of the array of light emitting devices and a surface of the layer nearest to the surface of the array of light emitting devices is from about five microns to about 400 microns.

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