Solid metal block mounting substrates for semiconductor light emitting devices

• US 7,183,587 B2
• Filed: 09/09/2003
• Issued: 02/27/2007
• Est. Priority Date: 09/09/2003
• Status: Active Grant

• Current Assignee: CREE Led Incorporated (Smart Global Holdings Incorporated)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Negley, Gerald H., Loh, Ban
• Primary Examiner(s): Le; Thao X.
• Application Number:
  US10/659,108
• Publication Number:
  US 20050051789A1
• Time in Patent Office: 1,267 Days
• Field of Search: 257 98- 99, 257/95, 257 81- 82, 257/91, 257/676, 257/E33.068, 257/E33.067, 257/680, 257/E25.032, 438/110, 438/22, 438/29, 361/600, 361/706, 361/707
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting

Abstract

A mounting substrate for a semiconductor light emitting device includes a solid metal block having a cavity in a face thereof that is configured for mounting a semiconductor light emitting device therein. An insulating coating is provided in the cavity, and first and second spaced apart conductive traces are provided on the insulating coating in the cavity that are configured for connection to a semiconductor light emitting device. The mounting substrate may be fabricated by providing a solid aluminum block including a cavity in a face thereof that is configured for mounting a semiconductor light emitting device therein. The solid aluminum block is oxidized to form an aluminum oxide coating thereon. The first and second spaced apart electrical traces are fabricated on the aluminum oxide coating in the cavity.

Claims

1. A mounting substrate for a semiconductor light emitting device comprising:

a solid aluminum block including a cavity in a first face thereof that is configured for mounting the semiconductor light emitting device therein;

a conformal insulating coating comprising aluminum oxide on a surface of the solid aluminum block, and in the cavity; and

first and second spaced apart conductive traces on the conformal insulating coating in the cavity that are configured for connection to the semiconductor light emitting device;

wherein the first and second spaced apart conductive traces extend from the cavity to the first face, around at least one side of the aluminum block and onto a second face of the aluminum block that is opposite the first face.

2. A mounting substrate according to claim 1 wherein the first and second spaced apart conductive traces on the conformal insulating coating in the cavity comprise reflective material.

3. A mounting substrate according to claim 1 in combination with the semiconductor light emitting device that is mounted in the cavity and is connected to the first and second spaced apart conductive traces.

4. A mounting substrate according to claim 3 in further combination with a lens that extends across the cavity.

5. A mounting substrate according to claim 4 in further combination with an encapsulant between the semiconductor light emitting device and the lens.

6. A mounting substrate according to claim 4 in further combination with a lens retainer on the solid aluminum block that is configured to hold the lens across the cavity.

7. A mounting substrate for a semiconductor light emitting device comprising:

a solid aluminum block including a cavity in a first face thereof that is configured for mounting the semiconductor light emitting device therein;

a conformal insulating coating comprising aluminum oxide on a surface of the solid aluminum block, and in the cavity; and

first and second spaced apart conductive traces on the conformal insulating coating in the cavity that are configured for connection to the semiconductor light emitting device;

wherein the solid aluminum block includes therein first and second through holes that extend from the first face outside the cavity to a second face of the solid aluminum block that is opposite the first face, the respective first and second through holes including the conformal insulating coating thereon that comprises aluminum oxide and a respective first and second conductive via therein that extends from the first face outside the cavity to the second face and wherein a respective one of the spaced apart conductive traces is electrically connected to a respective one of the conductive vias.

8. A mounting substrate according to claim 7 further comprising third and fourth spaced apart conductive traces on the second face of the solid aluminum block, a respective one of which is connected to a respective one of the conductive vias.

9. A mounting substrate according to claim 7 in combination with the semiconductor light emitting device that is mounted in the cavity and is connected to the first and second spaced apart conductive traces.

10. A mounting substrate according to claim 9 in further combination with a lens that extends across the cavity.

11. A mounting substrate according to claim 10 in further combination with an encapsulant between the semiconductor light emitting device and the lens.

12. A mounting substrate according to claim 10 in further combination with a lens retainer on the solid aluminum block that is configured to hold the lens across the cavity.

13. A light emitting device comprising:

a solid aluminum block including a cavity in a first face thereof and a conformal aluminum oxide coating on a surface thereof including in the cavity;

first and second spaced apart conductive traces on the conformal aluminum oxide coating in the cavity;

a semiconductor light emitting device that is mounted in the cavity and is connected to the first and second spaced apart conductive traces;

a lens that extends across the cavity; and

an encapsulant between the semiconductor light emitting device and the lens;

wherein the first and second spaced apart conductive traces extend from the cavity to the first face, around at least one side of the solid aluminum block and onto a second face of the solid aluminum block that is opposite the first face.

14. A light emitting device according to claim 13 wherein the first and second spaced apart conductive traces on the conformal aluminum oxide coating in the cavity comprise reflective material.

15. A light emitting device comprising:

a solid aluminum block including a cavity in a first face thereof and a conformal aluminum oxide coating on a surface thereof including in the cavity;

first and second spaced apart conductive traces on the conformal aluminum oxide coating in the cavity;

a semiconductor light emitting device that is mounted in the cavity and is connected to the first and second spaced apart conductive traces;

a lens that extends across the cavity; and

an encapsulant between the semiconductor light emitting device and the lens;

wherein the solid aluminum block includes first and second through holes that extend from the first face outside the cavity to a second face of the solid aluminum block that is opposite the first face, the respective first and second through holes including the conformal aluminum oxide coating thereon and a respective first and second conductive via therein that extends from the first face outside the cavity to the second face and wherein a respective one of the spaced apart conductive traces is electrically connected to a respective one of the conductive vias.

16. A light emitting device according to claim 15 further comprising third and fourth spaced apart conductive traces on the second face of the solid aluminum block, a respective one of which is connected to a respective one of the conductive vias.

17. A mounting substrate for a semiconductor light emitting device comprising:

a block including a cavity in a first face thereof that is configured for mounting the semiconductor light emitting device therein;

a conformal insulating coating on a surface of the block and in the cavity; and

first and second spaced apart conductive traces on the conformal insulating coating in the cavity that are configured for connection to the semiconductor light emitting device;

wherein the first and second spaced apart conductive traces extend from the cavity to the first face, around at least one side of the block and onto a second face of the block that is opposite the first face.

18. A mounting substrate according to claim 17 wherein the first and second spaced apart conductive traces on the conformal insulating coating in the cavity comprise reflective material.

19. A mounting substrate according to claim 17 in combination with the semiconductor light emitting device that is mounted in the cavity and is connected to the first and second spaced apart conductive traces.

20. A mounting substrate according to claim 17 in further combination with a lens that extends across the cavity.

21. A mounting substrate according to claim 20 in further combination with an encapsulant between the semiconductor light emitting device and the lens.

22. A mounting substrate according to claim 17 in further combination with a lens retainer on the block that is configured to hold the lens across the cavity.

23. A mounting substrate for a semiconductor light emitting device comprising:

a block including a cavity in a first face thereof that is configured for mounting the semiconductor light emitting device therein;

a conformal insulating coating on a surface of the block and in the cavity; and

first and second spaced apart conductive traces on the conformal insulating coating in the cavity that are configured for connection to the semiconductor light emitting device;

wherein the block includes therein first and second through holes that extend from the first face outside the cavity to a second face of the block that is opposite the first face, the respective first and second through holes including the conformal insulating coating thereon and a respective first and second conductive via therein that extends from the first face outside the cavity to the second face and wherein a respective one of the spaced apart conductive traces is electrically connected to a respective one of the conductive vias.

24. A mounting substrate according to claim 23 further comprising third and fourth spaced apart conductive traces on the second face of the block, a respective one of which is connected to a respective one of the conductive vias.

25. A mounting substrate according to claim 23 in combination with the semiconductor light emitting device that is mounted in the cavity and is connected to the first and second spaced apart conductive traces.

26. A mounting substrate according to claim 25 in further combination with a lens that extends across the cavity.

27. A mounting substrate according to claim 26 in further combination with an encapsulant between the semiconductor light emitting device and the lens.

28. A mounting substrate according to claim 26 in further combination with a lens retainer on the block that is configured to hold the lens across the cavity.