High-temperature reduced size manometer

• US 7,201,057 B2
• Filed: 09/30/2004
• Issued: 04/10/2007
• Est. Priority Date: 09/30/2004
• Status: Active Grant

• Current Assignee: MKS Instruments Incorporated
• Original Assignee: MKS Instruments Incorporated
• Inventors: Agami, Mark
• Primary Examiner(s): Lefkowitz; Edward
• Assistant Examiner(s): Jenkins; Jermaine
• Application Number:
  US10/954,386
• Publication Number:
  US 20060070447A1
• Time in Patent Office: 922 Days
• Field of Search: 73700-756, 3612831-2834
• US Class Current: 73/708
• CPC Class Codes: G01L 19/04 Means for compensating for effects of changes of temperature , i.e. other than electric compensation

Abstract

A pressure-sensing device and method for making and using such device having a temperature differential between two portions of the device is disclosed. A solid-state heat pump, such as a thermo-electric cooler (TEC), is used to pump heat from a cold portion to a hot portion of the device. A pressure sensor sensing the pressure of a hot fluid is disposed in the hot portion of the device, and sensor electronics are disposed in the cold portion of the device.

Claims

1. A pressure transducer, comprising:

a. a pressure sensor configured to operate above a first temperature;

b. one or more electronic components electrically coupled to the pressure sensor, the one or more electronic components being configured to operate below a second temperature, the first temperature being greater than the second temperature; and

c. a solid-state heat pump disposed between the pressure sensor and the one or more electronic components, the solid-state heat pump being configured to transfer heat from the one or more electronic components to the pressure sensor when the one or more electronic components are operating below the second temperature and the pressure sensor is operating above the first temperature.

2. A pressure transducer according to claim 1, the solid-state heat pump comprising a thermo electric cooler.

3. A pressure transducer according to claim 1, the pressure sensor being a capacitive pressure sensor.

4. A pressure transducer according to claim 3, the one or more electronic components generating an output signal, the output signal being generated according to a function of a capacitance of the pressure sensor.

5. A pressure transducer according to claim 1, the transducer including a housing, the pressure sensor being disposed in a first portion of the housing, the one or more electronic components being disposed in a second portion of the housing, the solid-state heat pump being disposed between the first and second portions of the housing.

6. A pressure transducer according to claim 5, the solid-state heat pump being configured to transfer heat from the second portion of the housing to the first portion of the housing when the first portion of the housing is above the first temperature and the second portion of the housing is below the second temperature.

7. A pressure transducer according to claim 6, the transducer including one or more heaters disposed proximal to the first portion of the housing.

8. A pressure transducer according to claim 7, the heaters configured to heat the first portion of the housing to at least the first temperature.

9. A pressure-sensing device, comprising:

a. a housing;

b. sensor electronics disposed within a first portion of the housing;

c. a pressure sensor disposed within a second portion of the housing; and

d. a solid-state heat pump disposed between the first and second portions of the housing, the solid state heat pump configured to transfer heat from a first face of the solid state heat pump, proximal to the first portion of the housing, to a second face of the solid state heat pump, proximal to the second portion of the housing.

10. The device of claim 9, wherein the solid state heat pump comprises a thermo-electric cooler.

11. The device of claim 9, wherein the first face of the solid state heat pump is colder than the second face of the solid state heat pump.

12. The device of claim 9, further comprising a thermal channel that conducts heat from a central portion of the device to a peripheral portion of the device.

13. The device of claim 12, wherein the thermal channel comprises a thermally-conducting plate disposed between the first and second portions of the housing.

14. The device of claim 12, wherein the thermal channel is thermally coupled to the housing.

15. The device of claim 9, wherein the second portion of the housing is adapted to operate at a higher temperature than the first portion.

16. The device of claim 9, wherein the pressure sensor comprises a capacitive pressure sensor.

17. The device of claim 9, further comprising an electric heater disposed in the second portion of the housing.

18. The device of claim 9, further comprising an external shell surrounding the housing.

19. A pressure-sensing device, comprising:

a. a housing;

b. a thermal channel substantially dividing the housing into a first portion and a second portion;

c. sensor electronics disposed within the first portion of the housing;

d. a capacitive pressure sensor disposed within the second portion of the housing; and

e. a thermo-electric cooler configured to transfer heat from a first face of the thermo-electric cooler, proximal to the first portion of the housing, to a second face of the thermo-electric cooler, proximal to the second portion of the housing.

20. The device of claim 19, further comprising an external shell surrounding at least a portion of the housing.

21. The device of claim 19 further comprising an electric heater that adds heat to the second portion of the housing.

22. The device of claim 19, further comprising a solid state heat pump, wherein the thermo-electric cooler is thermally coupled to the solid state heat pump and arranged such that both the thermo-electric cooler and the solid state heat pump move heat away from the first portion of the housing and towards the second portion of the housing.

23. The device of claim 22, wherein the solid-state heat pump comprises a second thermo-electric cooler.

24. The device of claim 19, wherein the thermal channel comprises a conductor that conducts heat from a central portion of the device to a peripheral portion of the device.

25. The device of claim 19, further comprising a second pressure sensor disposed within the second portion of the housing.

26. A pressure transducer, comprising:

a capacitive pressure sensor, the sensor defining an interior chamber and a flexible diaphragm, the diaphragm dividing the interior chamber into a first portion and a second portion, the second portion being evacuated to a vacuum reference pressure, the diaphragm flexing in a first direction when a pressure in the first portion is greater than the vacuum reference pressure, the diaphragm flexing in a second direction when the pressure in the first portion is less than the vacuum reference pressure, the sensor further including a conductive element disposed in the second portion, at least a portion of the diaphragm being conductive, a capacitance of the conductive element and the conductive portion of the diaphragm being representative of a pressure in the first portion;

a thermally conductive heater shell, the capacitive pressure sensor being disposed within the heater shell;

an external enclosure, the heater shell being disposed within the external enclosure;

one or more electronic components electrically coupled to the pressure sensor, the one or more electronic components generating an output signal representative of the pressure within the first portion of the interior chamber, the one or more electronic components being disposed within the external enclosure and outside the heater shell; and

a solid state heat pump disposed between the one or more electronic components and the pressure sensor, the heat pump being configured to transfer heat from the one or more electronic components to the pressure sensor.

27. The transducer of claim 26, wherein the solid state heat pump comprises a thermo-electric cooler.

28. The transducer of claim 26, wherein one or more electronic components operate at a lower temperature than does the capacitive pressure sensor.

29. The transducer of claim 26, further including one or more electric heaters that heat the heater shell.