Separating of optical integrated modules and structures formed thereby

• US 7,208,771 B2
• Filed: 09/21/2004
• Issued: 04/24/2007
• Est. Priority Date: 03/06/2001
• Status: Expired due to Term

• Current Assignee: FLIR Systems Trading Belgium BVBA
• Original Assignee: Digital Optics Corp. (Adeia Inc.)
• Inventors: Han, Hongtao, Mathews, Jay, Hammond, John Barnett, Kathman, Alan D
• Primary Examiner(s): Huynh; Andy
• Assistant Examiner(s): GOODWIN, DAVID J
• Application Number:
  US10/945,090
• Publication Number:
  US 20050035463A1
• Time in Patent Office: 945 Days
• Field of Search: 438/22, 438/116, 257/99, 156/250
• US Class Current: 257/99
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: G02B 6/4274 Electrical aspects G02B6/4263 and G02B6/4265 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01S 5/0201 Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
• CPC Class Codes: H01S 5/02315 Support members, e.g. bases or carriers
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: H01S 5/0233 Mounting configuration of laser chips
• CPC Class Codes: H01S 5/02345 Wire-bonding
• CPC Class Codes: H01S 5/0235 Method for mounting laser chips
• CPC Class Codes: H01S 5/183 having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing

Abstract

A structure having an optical element thereon has a portion of the structure extending beyond a region having the optical element in at least one direction. The structure may include an active optical element, with the different dimensions of the substrates forming the structure allowing access for the electrical interconnections for the active optical elements. Different dicing techniques may be used to realize the uneven structures.

Claims

1. An integrated electro-optical module, comprising:

an active element on a first substrate;

a feature on a second substrate;

a bonding pad on one of the first and second substrates;

a spacer substrate between the first substrate and the second substrate in a vertical direction, a portion of the first and second substrates having the bonding pad thereon extending further in at least one direction than the other substrate; and

an electrical interconnection extending from the active element to the bonding pad through the means for attaching.

2. The integrated electro-optical module of claim 1, wherein the first and second substrates are attached via the spacer substrate.

3. The integrated electro-optical module of claim 1, wherein the electrical bonding pad is on the first substrate.

4. The integrated electro-optical module of claim 1, wherein the bonding pad is on the second substrate.

5. The integrated electro-optical module of claim 4, further comprising an electrically conductive material between the first and second substrates.

6. The integrated electro-optical module of claim 5, wherein the electrically conductive material includes solder balls.

7. The integrated electro-optical module of claim 5, wherein the electrically conductive material is on an element between the first and second substrates.

8. The integrated electro-optical module of claim 1, wherein the features are optical elements.

9. The integrated electro-optical module of claim 1, wherein the features are holes.

10. The integrated electro-optical module of claim 1, wherein the features are indentations.

11. The integrated electro-optical module of claim 1, wherein the means for attaching hermetically seals the active element.

12. An integrated electro-optical module, comprising:

an active element on a first substrate;

a feature on a second substrate;

a bonding pad on one of the first and second substrates;

means for attaching the first substrate and the second substrate in a vertical direction to one another, a portion of the first and second substrates having the bonding pad thereon extending further in at least one direction than the other substrate;

an electrical interconnection extending from the active element to the bonding pad through the means for attaching, the electrical interconnection including conductive material between the first and second substrates.

13. The integrated electro-optical module of claim 12, wherein the electrically conductive material includes solder balls.

14. The integrated electro-optical module of claim 13, wherein the electrically conductive material is on an element between the first and second substrates.

15. The integrated electro-optical module of claim 12, wherein the means for attaching hermetically seals the active element.

16. The integrated electro-optical module of claim 12, wherein the features are optical elements.

17. The integrated electro-optical module of claim 12, wherein the features are holes.

18. The integrated electro-optical module of claim 12, wherein the features are indentations.

19. The integrated electro-optical module of claim 12, wherein the electrical bonding pad is on the first substrate.

20. The integrated electro-optical module of claim 12, wherein the bonding pad is on the second substrate.