Multi-polar feedthrough array for analog communication with implantable medical device circuitry

• US 7,210,966 B2
• Filed: 07/12/2004
• Issued: 05/01/2007
• Est. Priority Date: 07/12/2004
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Knowles, Shawn D., Taylor, William J., Olson, John C.
• Primary Examiner(s): Figueroa; Felix O.
• Application Number:
  US10/889,771
• Publication Number:
  US 20060009813A1
• Time in Patent Office: 1,023 Days
• Field of Search: 439/620.09, 439/620.05, 439/620.07, 439/620.13, 439/587, 439/271, 439/278, 361/302, 361/307, 361/301.1, 361/323, 607/2, 607/5
• US Class Current: 439/620.09
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/3718 Monitoring of or protection against external electromagnetic fields or currents
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H01R 13/7197 with filters integral with or fitted onto contacts, e.g. tubular filters
• CPC Class Codes: H01R 2201/12 for medicine and surgery

Abstract

An improved multi-polar feedthrough assembly employs a particular metallic ferrule material for improved dimensional stability during initial fabrication and sustained hermetic operation. In one aspect, the disclosure relates to implantable medical devices (IMDs) including an IMD enclosure fabricated with grade 2 titanium and having a ferrule material fabricated with grade 4 titanium or grade 5 titanium. In one form, the multi-polar feedthrough assembly includes a filtered feedthrough array (e.g., employing capacitive filters coupled to the electrically conductive pins or serpentine conductors of the array). According to another aspect, the improved multi-polar feedthrough assembly incorporates additional pins, thus increasing the footprint of the assembly, and the additional pins provide analog electrical communication between operative circuitry inside an IMD and analog components external to the IMD.

Claims

1. A multi-polar array for an implantable medical device, comprising;

a titanium ferrule surrounding the outer periphery of the array and adapted to mechanically couple to a corresponding inner periphery of a titanium surface of an implantable medical device, said ferrule having a plurality of conductive pin-receiving bores formed through a major surface thereof, and wherein said ferrule consists of one of grade 4 titanium and grade 5 titanium;

a plurality of electrically insulative members sealingly disposed within each said plurality of bores and wherein each of said members is adapted to receive at least one conductive feedthrough pin;

a plurality of conductive feedthrough pins, each said pin disposed within one of said plurality of electrically insulative members; and

a plurality of capacitive elements adapted to reduce or eliminate electromagnetic interference from at least some of the plurality of the conductive feedthrough pins, effectively disposed proximate said at some of the plurality of the conductive feedthrough pins

wherein the plurality of conductive feedthrough pins exceeds the plurality of capacitive elements by at least one pin, so that an analog and/or digital signal coupled to a non-capacitively filtered feedthrough pin substantially completely conducts via said pin.

2. A multi-polar array according to claim 1, wherein the plurality of pin-receiving bores comprises at least four bores.

3. A multi-polar array according to claim 1, wherein the plurality of pin-receiving bores comprises at least six bores.

4. A multi-polar array according to claim 1, wherein the plurality of pin-receiving bores comprises at least eight bores.

5. A multi-polar array according to claim 4, wherein the plurality of pin-receiving bores are arranged in a linear array of bores.

6. A multi-polar array according to claim 1, wherein the titanium surface consists of grade 2 titanium.

7. A multi-polar array according to claim 1, wherein the plurality of electrically insulative members comprises at least one of:

a polysilicon material, a glass material, an amorphous material, a ceramic material.

8. A multi-polar array according to claim 1, wherein at least one of the plurality of conductive feedthrough pins comprises one of:

a titanium material, a tantalum material, a niobium material, a platinum material, or an alloy of any foregoing materials.

9. A multi-polar array according to claim 1, further comprising a spacer element disposed proximate the non-capacitively filtered feedthrough pin.

10. A multi-polar array according to claim 9, wherein said spacer element includes a feature abutting a portion of the non-capacitively filtered feedthrough pin, said feature comprising one of:

a bore, a slot, an edge surface, a wedge-shaped cut-out.

11. A multi-polar array according to claim 9, wherein said spacer element comprises at least one of:

a resin-based material, a polymer-based material, an alumina material, a polysilicon material, a glass material, an amorphous material, a ceramic material.

12. A multi-polar array according to claim 1, wherein the non-capacitively filtered feedthrough pin is electrically coupled to operative circuitry of the implantable medical device.

13. A multi-polar array according to claim 1, further comprising:

an active electrical circuit coupled to at least one of said plurality of conductive feedthrough pins.