Light emitting diode component
First Claim
Patent Images
1. A light emitting package comprising:
- a printed circuit board supporting at least one light emitting die and having at least two electrical terminals, printed circuitry of the printed circuit board connecting the at least one light emitting die with the at least two electrical terminals to provide power thereto;
a light transmissive cover disposed over the at least one light emitting die but not over the at least two electrical terminals, the cover having an open end defining a cover perimeter connected with the printed circuit board, an inside surface of the cover together with the printed circuit board defining an interior volume containing the at least one light emitting die;
an encapsulant disposed in and at least substantially filling the interior volume and covering the at least one light emitting die; and
a phosphor disposed proximate to the light transmissive cover and remote from the at least one light emitting die, the encapsulant that at least substantially fills the interior volume promoting light coupling between the at least one light emitting die and the remote phosphor.
8 Assignments
0 Petitions
Accused Products
Abstract
A light emitting package (8, 8′, 8″, 208, 408) includes a printed circuit board (10, 10′, 10″, 210, 410) supporting at least one light emitting die (12, 12″, 14, 16, 212, 412). A light transmissive cover (60, 60′, 60″, 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62′, 62″, 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70″, 270, 470) containing the at least one light emitting die. An encapsulant (76, 76″, 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.
290 Citations
38 Claims
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1. A light emitting package comprising:
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a printed circuit board supporting at least one light emitting die and having at least two electrical terminals, printed circuitry of the printed circuit board connecting the at least one light emitting die with the at least two electrical terminals to provide power thereto; a light transmissive cover disposed over the at least one light emitting die but not over the at least two electrical terminals, the cover having an open end defining a cover perimeter connected with the printed circuit board, an inside surface of the cover together with the printed circuit board defining an interior volume containing the at least one light emitting die; an encapsulant disposed in and at least substantially filling the interior volume and covering the at least one light emitting die; and a phosphor disposed proximate to the light transmissive cover and remote from the at least one light emitting die, the encapsulant that at least substantially fills the interior volume promoting light coupling between the at least one light emitting die and the remote phosphor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A light emitting package comprising:
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a printed circuit board that is substantially planar, supports at least one light emitting die, and has at least two electrical terminals, printed circuitry of the printed circuit board connecting the at least one light emitting die with the at least two electrical terminals to provide power thereto; a light transmissive cover disposed over the at least one light emitting die but not over the at least two electrical terminals, the cover having an open end defining a cover perimeter connected with the printed circuit board, an inside surface of the cover together with the printed circuit board defining an interior volume containing the at least one light emitting die; an encapsulant disposed in and at least substantially filling the interior volume and covering the at least one light emitting die; and a phosphor disposed proximate to the light transmissive cover and remote from the at least one light emitting die, the encapsulant that at least substantially fills the interior volume promoting light coupling between the at least one light emitting die and the remote phosphor. - View Dependent Claims (15)
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16. A light emitting package comprising:
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a printed circuit board supporting at least one light emitting die and having at least two electrical terminals, printed circuitry of the printed circuit board connecting the at least one light emitting die with the at least two electrical terminals to provide power thereto; a light transmissive glass cover disposed over the at least one light emitting die but not over the at least two electrical terminals, the glass cover having an open end defining a cover perimeter connected with the printed circuit board, an inside surface of the glass cover together with the printed circuit board defining an interior volume containing the at least one light emitting die; an encapsulant disposed in and at least substantially filling the interior volume and covering the at least one light emitting die; and a phosphor disposed proximate to the light transmissive glass cover and remote from the at least one light emitting die, the encapsulant that at least substantially fills the interior volume promoting light coupling between the at least one light emitting die and the remote phosphor. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A light emitting package comprising:
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a printed circuit board supporting at least one light emitting die and having at least two electrical terminals, printed circuitry of the printed circuit board connecting the at least one light emitting die with the at least two electrical terminals to provide power thereto; a light transmissive cover disposed over the at least one light emitting die but not over the at least two electrical terminals, the cover having an open end defining a cover perimeter connected with the printed circuit board, an inside surface of the cover together with the printed circuit board defining an interior volume containing the at least one light emitting die; an encapsulant disposed in and at least substantially filling the interior volume and covering the at least one light emitting die; and a phosphor disposed proximate to the light transmissive cover and remote from the at least one light emitting die, the phosphor being distributed in a portion of the encapsulant distal from the at least one light emitting die and proximate to the light transmissive cover, the encapsulant that at least substantially fills the interior volume promoting light coupling between the at least one light emitting die and the remote phosphor.
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28. A light emitting package comprising:
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a printed circuit board supporting at least one light emitting die and having at least two electrical terminals, printed circuitry of the printed circuit board connecting the at least one light emitting die with the at least two electrical terminals to provide power thereto; a light transmissive cover disposed over the at least one light emitting die but not over the at least two electrical terminals, the cover having an open end defining a cover perimeter connected with the printed circuit board, an inside surface of the cover together with the printed circuit board defining an interior volume containing the at least one light emitting die; an encapsulant disposed in and at least substantially filling the interior volume and covering the at least one light emitting die; and a phosphor disposed proximate to the light transmissive cover and remote from the at least one light emitting die, the encapsulant that at least substantially fills the interior volume promoting light coupling between the at least one light emitting die and the remote phosphor; wherein a surface of the printed circuit board disposed inside the light transmissive cover is reflective for light emitted by the at least one light emitting die and for light emitted by the phosphor, and a surface of the printed circuit board disposed outside the light transmissive cover is reflective for light emitted by the phosphor.
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29. A light emitting package comprising:
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a printed circuit board supporting a plurality of bare light emitting dice and having at least two electrical terminals, printed circuitry of the printed circuit board connecting the plurality of bare light emitting dice with the at least two electrical terminals to provide power thereto; a light transmissive cover disposed over the plurality of bare light emitting dice but not over the at least two electrical terminals, the cover having an open end defining a cover perimeter connected with the printed circuit board, an inside surface of the cover together with the printed circuit board defining an interior volume containing the plurality of bare light emitting dice; an encapsulant disposed in and at least substantially filling the interior volume and covering the plurality of bare light emitting dice such that the bare light emitting dice are commonly encapsulated by the encapsulant and do not include separate encapsulation; and a phosphor disposed proximate to the light transmissive cover and remote from the plurality of bare light emitting dice, the encapsulant that at least substantially fills the interior volume promoting light coupling between the plurality of bare light emitting dice and the remote phosphor. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37)
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38. A light emitting package comprising:
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a printed circuit board supporting at least one light emitting die and having at least two electrical terminals, the at least one light emitting die being flip-chip bonded to the printed circuitry of the printed circuit board, the printed circuitry connecting the at least one light emitting die with the at least two electrical terminals to provide power thereto; a light transmissive cover disposed over the at least one light emitting die but not over the at least two electrical terminals, the cover having an open end defining a cover perimeter connected with the printed circuit board, an inside surface of the cover together with the printed circuit board defining an interior volume containing the at least one light emitting die; an encapsulant disposed in and at least substantially filling the interior volume and covering the at least one light emitting die; and a phosphor disposed proximate to the light transmissive cover and remote from the at least one light emitting die, the encapsulant that at least substantially fills the interior volume promoting light coupling between the at least one light emitting die and the remote phosphor.
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Specification