Device for coupling PCB sheet having position deciding jig part

• US 7,234,217 B2
• Filed: 01/21/2005
• Issued: 06/26/2007
• Est. Priority Date: 02/23/1999
• Status: Expired due to Term

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Choi, Bong Kyu, Choi, Chun Ho
• Primary Examiner(s): Chang; Rick Kiltae
• Application Number:
  US11/038,050
• Publication Number:
  US 20050128725A1
• Time in Patent Office: 886 Days
• Field of Search: 298/30, 298/31, 294/020.8, 298/32, 174/250, 174/255, 174/52.1, 361/801, 361/802, 361/732, 361/740
• US Class Current: 29/402.08
• CPC Class Codes: B01F 2101/23 Mixing of laboratory samples e.g. in preparation of analysing or testing properties of materials
• CPC Class Codes: B01F 25/50 Circulation mixers, e.g. wherein at least part of the mixture is discharged from and reintroduced into a receptacle
• CPC Class Codes: B01F 31/65 the materials to be mixed being directly submitted to a pulsating movement, e.g. by means of an oscillating piston or air column
• CPC Class Codes: B01F 31/651 Mixing by successively aspirating a part of the mixture in a conduit, e.g. a piston, and reinjecting it through the same conduit into the receptacle
• CPC Class Codes: B01F 33/00 Other mixers; Mixing plants; Combinations of mixers
• CPC Class Codes: G01N 2035/106 by sucking and blowing
• CPC Class Codes: G01N 35/10 Devices for transferring samples or any liquids to, in, or from, the analysis apparatus, e.g. suction devices, injection devices G01N35/0099 takes precedence
• CPC Class Codes: H01L 21/485 Adaptation of interconnections, e.g. engineering charges, repair techniques
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 2203/0165 Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence
• CPC Class Codes: H05K 3/225 Correcting or repairing of printed circuits H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49135 and shaping, e.g., cutting or bending, etc.
• CPC Class Codes: Y10T 29/49149 : by metal fusion bonding
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/4973 : Replacing of defective part
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 29/5317 : Laminated device
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/53196 : Means to apply magnetic force directly to position or hold work part

Abstract

A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2′ is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2′, the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2′ is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.

Claims

1. A device for coupling a PCB sheet, comprising:

a position deciding jig part for receiving a PCB sheet with a plurality of circuit patterns printed thereon and a replaced good quality circuit pattern sheet, after a defective circuit pattern sheet is cut away, and after said good quality circuit pattern sheet is placed into a space of said removed defective circuit pattern sheet;

a PCB securing means attached on said PCB securing plate, for preventing any loose movements of said PCB sheet and said good quality circuit pattern sheet, both of them inserted into said jig part; and

an adhesive means filled into a space between said PCB sheet and said replaced good quality circuit pattern sheet to be cured so as to couple them together.

2. The device as claimed in claim 1, further comprising a position locating means said position locating means consisting of a plurality of PCB securing pins upstanding on said PCB securing jig part, and a plurality of pin receiving holes formed in said PCB sheet and on said good quality circuit pattern sheet, said PCB securing pins being inserted into said pin receiving holes.

3. The device as claimed in claim 1, wherein said PCB securing jig part comprises a plurality of separating walls to separate said sheets of said PCB sheet and said good quality circuit pattern sheet from each other.

4. The device as claimed in claim 1, wherein said PCB securing means is a heat resistant tape for preventing thermal deformations.

5. The device as claimed in claim 4, wherein said heat resistant tape is a both face tape to secure said PCB and said good quality circuit pattern sheet to said jig.

6. The device as claimed in claim 1, wherein said space for coupling said PCB sheet and said good quality circuit pattern sheet together forms a channel.

7. The device as claimed in claim 1, wherein said adhesive means a high temperature adhesive for preventing thermal deformations.

8. The device as claimed in claim 1, further comprising a flat cover disposed on said circuit patterns of said PCB sheet or said good quality circuit pattern sheet to protect the same.

9. The device as claimed in claim 1, wherein said space formed between said PCB sheet and said good quality circuit pattern sheet for receiving said adhesive means has a width of 1 to 5 mm between said PCB sheet and said good quality circuit pattern sheet.

10. A device for coupling a PCB sheet, comprising:

a position deciding jig part for receiving a PCB sheet with a plurality of circuit patterns printed thereon and a replaced good quality circuit pattern sheet, after a defective circuit pattern sheet is cut away, and after said good quality circuit pattern sheet is placed into a space of said removed defective circuit pattern sheet;

a PCB securing element attached on said PCB securing plate, for preventing any loose movements of said PCB sheet and said good quality circuit pattern sheet, both of them inserted into said jig part; and

an adhesive element filled into a space between said PCB sheet and said replaced good quality circuit pattern sheet to be cured so as to couple them together.

11. The device as claimed in claim 10, further comprising a position locating element said position locating element consisting of a plurality of PCB securing pins upstanding on said PCB securing jig part, and a plurality of pin receiving holes formed in said PCB sheet and on said good quality circuit pattern sheet, said PCB securing pins being inserted into said pin receiving holes.

12. The device as claimed in claim 10, wherein said PCB securing jig part comprises a plurality of separating walls to separate said sheets of said PCB sheet and said good quality circuit pattern sheet from each other.

13. The device as claimed in claim 10, wherein said PCB securing element is a heat resistant tape for preventing thermal deformations.

14. The device as claimed in claim 13, wherein said heat resistant tape is a both face tape to secure said PCB and said good quality circuit pattern sheet to said jig.

15. The device as claimed in claim 10, wherein said space for coupling said PCB sheet and said good quality circuit pattern sheet together forms a channel.

16. The device as claimed in claim 10, wherein said adhesive element a high temperature adhesive for preventing thermal deformations.

17. The device as claimed in claim 10, further comprising a flat cover disposed on said circuit patterns of said PCB sheet or said good quality circuit pattern sheet to protect the same.

18. The device as claimed in claim 10, wherein said space formed between said PCB sheet and said good quality circuit pattern sheet for receiving said adhesive element has a width of 1 to 5 mm between said PCB sheet and said good quality circuit pattern sheet.