Illumination apparatus and method

• US 7,241,030 B2
• Filed: 07/30/2004
• Issued: 07/10/2007
• Est. Priority Date: 07/30/2004
• Status: Expired due to Fees

• Current Assignee: Epistar Corporation
• Original Assignee: Avago Technologies ECBU IP Singapore Pte Limited (Broadcom, Inc.)
• Inventors: Ou, Wen Ya, Mok, Thye Linn, Yogananadan, Sundar Natarajan, Lee, Kian Shin, Tan, Kheng Leng, Pang, Siew It, Kuan, Yew Cheong, Karim, Norfidathul Aizar Abdul, Oon, Su Lin, Afif, Fakhrul Arifin Mohd
• Primary Examiner(s): Ward, John Anthony
• Application Number:
  US10/903,147
• Publication Number:
  US 20060023448A1
• Time in Patent Office: 1,075 Days
• Field of Search: 362/249, 362/294, 362/373, 362/271, 362/272
• US Class Current: 362/294
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21S 10/026 by movement of parts, e.g. by movement of reflectors or light sources F21S10/007 takes precedence
• CPC Class Codes: F21V 29/63 using electrically-powered vibrating means; using ionic wind
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2105/12 characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 2201/066 Heatsink mounted on the surface of the PCB heatsink inserted in the PCB H05K2201/10416
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]

Abstract

Illumination apparatus includes a support structure, at least one light emitting element, and a heat sink thermally coupled to the light emitting element. The light emitting element and heat sink are moveable in relation to the support structure. An actuator system moves the at least one light emitting element and the heat sink with respect to the support structure.

Claims

1. An illumination apparatus, comprising:

a support structure;

at least one light emitting element;

a heat sink thermally coupled to said at least one light emitting element, said at least one light emitting element and said heat sink being moveable in relation to said support structure;

an actuator system operatively associated with said at least one light emitting element, said actuator system being configured to move said at least one light emitting element and said heat sink with respect to said support structure such that air flow is induced around said heat sink and thermal cooling thereof is effected;

wherein said light emitting elements are arranged in a plurality of rows, and wherein said heat sink comprises a plurality of heat sinks mounted to said rows of light emitting diodes, said rows of light emitting elements and said heat sinks being independently moveable with respect to said support structure.

2. The apparatus of claim 1, wherein said actuator system comprises a motor and, a drive system operatively associated with said motor, said drive system converting rotational movement of a motor shaft to linear movement.

3. The illumination apparatus of claim 1, wherein said at least one light emitting element comprises a plurality of light emitting elements arranged in a plurality of triads, said plurality of triads being arranged in a repeating order in side by side relation to form a two-dimensional array of light emitting elements.

4. The illumination apparatus of claim 3, wherein each of said plurality of triads extends over a length, and wherein said actuator system moves said plurality of triads a distance of at least said length of said triad.

5. A method, comprising:

mounting at least one light emitting element with a heat sink to a support structure so that said at least one light emitting element and said heat sink are movable with respect to said support structure; and

moving said at least one light emitting element and said heat sink with regard to said support structure such that air flow is induced around said heat sink and thermal cooling thereof is effected;

wherein said moving step comprises linearly moving said at least one light emitting element and said heat sink with regard to said support structure.