Method of manufacturing a data carrier

• US 7,242,079 B2
• Filed: 10/15/2003
• Issued: 07/10/2007
• Est. Priority Date: 10/15/2002
• Status: Expired due to Fees

• Current Assignee: Gemalto SA (Thales SA)
• Original Assignee: Axalto S A
• Inventors: Reignoux, Yves, Nerot, Dorothe
• Primary Examiner(s): Crane; Sara
• Assistant Examiner(s): IM, JUNGHWA M
• Application Number:
  US10/531,365
• Publication Number:
  US 20060012023A1
• Time in Patent Office: 1,364 Days
• Field of Search: 257/679, 257/668, 257/692, 257/730, 257/666, 257/676, 257/680, 257/694
• US Class Current: 257/679
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method of manufacturing a data carrier from a support strip includes an overmoulding step, in which at least one support element of the support strip is overmoulded so as to obtain a data carrier body, and a microcircuit-connecting step, in which a microcircuit is electrically connected to the wiring pads of the data carrier body so as to obtain the data carrier.

Claims

1. A support strip comprising:

at least one roughly parallel gripping area; and

a first support element and at least a second support element,

wherein the first support element comprises a first set of conducting elements, each of said conducting elements having a contact pad and a wiring pad,

wherein the second support element comprises a second set of conducting elements, each of said conducting elements having a contact pad and a wiring pad, and

wherein the first support element is connected to the at least one gripping area using at least a first snap-off junction area,

wherein the second support element is connected to the at least one gripping area using at least a second snap-off junction area, and

wherein each support element is configured to be overmoulded to obtain respectively a first and at least a second data carrier body.

2. The support strip according to claim 1, wherein the support element is a support grid.

3. The support strip according to claim 1, wherein the support element comprises a first set of foolproofing holes.

4. The support strip according to claim 3, wherein the support element comprises a second set of foolproofing holes.

5. The support strip according to claim 2, wherein the support grid is metallic.

6. The support strip according to claim 1, wherein the first support element has a contour whose geometry substantially complies with GSM 11.11.

7. The support strip according to claim 1, wherein the support element is arranged to receive an electronic component.

8. The support strip according to claim 7, wherein the electronic component is a microcircuit.

9. The support strip of according to claim 1, wherein the first support element is overmoulded using a thermoplastic.

10. The support strip according to claim 1, wherein a microcircuit is connected to at least one wiring pad in the first set of conducting elements after the first support element has been overmoulded.