Separable electrical interconnect with anisotropic conductive elastomer for translating footprint

• US 7,249,954 B2
• Filed: 07/17/2006
• Issued: 07/31/2007
• Est. Priority Date: 02/26/2002
• Status: Expired due to Term

• Current Assignee: Paricon Technologies Corporation
• Original Assignee: Paricon Technologies Corporation
• Inventors: Weiss, Roger E.
• Primary Examiner(s): DINH, PHUONG K
• Application Number:
  US11/457,849
• Publication Number:
  US 20070015375A1
• Time in Patent Office: 379 Days
• Field of Search: 439/66, 439/91, 439/591, 439/531
• US Class Current: 439/66
• CPC Class Codes: H01R 12/707 Soldering or welding
• CPC Class Codes: H01R 12/7076 for connection between PCB and component, e.g. display
• CPC Class Codes: H01R 12/7082 Coupling device supported only by cooperation with PCB
• CPC Class Codes: H01R 12/714 with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
• CPC Class Codes: H01R 13/2414 conductive elastomers
• CPC Class Codes: H01R 31/06 Intermediate parts for linking two coupling parts, e.g. adapter with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/94
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/0314 Elastomeric connector or conductor, e.g. rubber with metallic filler elastomeric dielectric H05K2201/0133
• CPC Class Codes: H05K 2201/049 PCB for one component, e.g. for mounting onto mother PCB
• CPC Class Codes: H05K 2201/10325 Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
• CPC Class Codes: H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308

Abstract

A separable electrical connector for electrically interconnecting an electrical device to a substrate. In one embodiment, the connector includes an adapter board electrically connected to the substrate, the adapter board having electrical contacts on both sides, and a layer of ACE between the electrical device and the adapter board. A mechanical structure is used to apply a compressive force on the ACE through the adapter board and the electrical device. In another embodiment, the connector includes a translator board having electrical contacts on both sides and electrical circuits within to expand the footprint of the fine pitch electrical device to the coarser pitch of the substrate. The connector further includes a layer of ACE between the translator board and the substrate.

Claims

1. An apparatus for electrically coupling an electrical device to a substrate, comprising:

a translator board having a first side, a second side, a first plurality of electrical contacts,

a second plurality of electrical contacts, and a plurality of electrical circuits; and

a layer of anisotropic conductive elastomer (ACE) disposed between the translator board and the substrate, wherein

the first plurality of electrical contacts are disposed on the first side of the translator board and are positioned to be aligned with a plurality of corresponding conductors on the electrical device, the electrical device having a first contact pitch, and

the second plurality of electrical contacts are disposed on the second side of the translator board and are positioned to be aligned with a plurality of corresponding conductors on the substrate, the substrate having a second contact pitch which differs from the first contact pitch, and

the plurality of electrical circuits are disposed between the first plurality of electrical contacts and the second plurality of electrical contacts and accomplish at least in part the translation from the first pitch of the electrical device to the second pitch of the substrate, and

the layer of ACE accomplishes at least in part the electrical connection between the translator board and the substrate.

2. The apparatus of claim 1, where the electrical device is a semiconductor chip.

3. The apparatus of claim 1, where the electrical device is disposed within a socket, the socket accomplishing at least in part the electrical interface between the electrical device and the substrate.

4. The apparatus of claim 3, where the electrical device is removably disposed within the socket.

5. The apparatus of claim 1, where the second contact pitch is greater than the first contact pitch.