Package for housing an optoelectronic assembly
First Claim
1. A package configured to house an optoelectronic assembly, the package comprising:
- an insulating base having an upper surface;
an optoelectronic device attached directly to the upper surface of the insulating base;
a first metal member comprising a bottom wall and a top wall, the bottom wall of the first metal member being attached directly to the upper surface of the insulating base, the metal member being in electrical contact with an electrically conductive via within the insulating base; and
a metal cover having a rim located at a bottom portion thereof, the rim of the metal cover being configured to attach to the top wall of the first metal member to hermetically seal the metal cover to the insulating base.
6 Assignments
0 Petitions
Accused Products
Abstract
A package for housing an optoelectronic device and an integrated circuit is disclosed. The package includes an insulating base having an upper surface. The optoelectronic device and the integrated circuit are mounted to the upper surface of the insulating base. The package also includes a metal sealing member having a top wall and a bottom wall. The bottom wall of the metal sealing member is attached to the upper surface of the insulating base. The package further includes a metal cover having a rim located at a bottom portion thereof. The rim of the metal cover is adapted to attach to the top wall of the metal sealing member to thereby hermetically seal the metal cover to the insulating base.
60 Citations
21 Claims
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1. A package configured to house an optoelectronic assembly, the package comprising:
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an insulating base having an upper surface; an optoelectronic device attached directly to the upper surface of the insulating base; a first metal member comprising a bottom wall and a top wall, the bottom wall of the first metal member being attached directly to the upper surface of the insulating base, the metal member being in electrical contact with an electrically conductive via within the insulating base; and a metal cover having a rim located at a bottom portion thereof, the rim of the metal cover being configured to attach to the top wall of the first metal member to hermetically seal the metal cover to the insulating base. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for providing a hermetic enclosure, the method comprising:
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attaching an optoelectronic device directly to an upper surface of an insulating base; attaching a bottom wall of a first metal member directly to the upper surface of the insulating base; positioning a metal cover over the optoelectronic device, the metal cover comprising a rim at a bottom portion thereof; attaching the rim of the metal cover to a top wall of the first metal member to hermetically enclose the optoelectronic device; forming a plurality of holes that extends from the upper surface of the insulating base to a lower surface of the insulating base; and filling the plurality of holes with a conductive material, where the first metal member is in electrical contact with the plurality of holes filled with conductive material. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15)
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16. A packaged optical module, comprising:
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a base formed of an electrically insulating material and having at least a first surface and a second surface, for mounting an optical device being in direct contact to the base at the first surface, wherein the base has a plurality of electrically conductive vias; a sealing member formed of an electrically conducting material and attached directly to the base, the sealing member extending along a perimeter of the base with the optical device being located within an inner region of the sealing member, the sealing member being in electrical contact with at least one of the plurality of electrically conductive vias; a heat dissipating device attached to the second surface of the base; and a cover formed of the electrically conducting material, the cover being configured to attach to the sealing member on the base to provide a hermetic enclosure for the optical device.
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17. A package configured to house an optoelectronic assembly, the package comprising:
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an insulating base having an upper surface and a lower surface, and having a plurality of electrically conductive vias extending from the upper to the lower surface; an optoelectronic device attached to the upper surface of the insulating base and in electrical contact with at least one of the vias; a metal member comprising a bottom wall and a top wall, the bottom wall of the metal member being attached directly to the upper surface of the insulating base and in electrical contact with at least one other of the vias; and a metal cover having a rim located at a bottom portion thereof, the rim of the metal cover being configured to attach to the top wall of the metal member to hermetically seal the metal cover to the insulating base. - View Dependent Claims (18, 19, 20, 21)
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Specification