Cantilever microprobes for contacting electronic components and methods for making such probes
First Claim
1. An array of cantilever probes for making contact with an electronic circuit element, comprising:
- a plurality of independent cantilever probes, each having a base portion, a support functionally connected to the base portion, a cantilever portion functionally connected to the support, and a contact portion functionally connected to the cantilever portion for making contact with the electronic circuit element;
a substrate containing at least two bonding locations for each of the plurality of cantilever probes; and
a bonding material functionally attaching base portions of the cantilever probes to their respective bonding locations on said substrate,wherein for at least a plurality of pairs of first and second cantilever probes, an opening is provided in a base of the first probe between the at least two bonding locations such that the opening provides a space for bonding for the second probe to be used in bonding the second probe to the substrate without the bonding material for the second probe shorting to the base of first probe whereby interlaced bonding locations for a plurality of probes are provide.
1 Assignment
0 Petitions
Accused Products
Abstract
Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
63 Citations
8 Claims
-
1. An array of cantilever probes for making contact with an electronic circuit element, comprising:
-
a plurality of independent cantilever probes, each having a base portion, a support functionally connected to the base portion, a cantilever portion functionally connected to the support, and a contact portion functionally connected to the cantilever portion for making contact with the electronic circuit element; a substrate containing at least two bonding locations for each of the plurality of cantilever probes; and a bonding material functionally attaching base portions of the cantilever probes to their respective bonding locations on said substrate, wherein for at least a plurality of pairs of first and second cantilever probes, an opening is provided in a base of the first probe between the at least two bonding locations such that the opening provides a space for bonding for the second probe to be used in bonding the second probe to the substrate without the bonding material for the second probe shorting to the base of first probe whereby interlaced bonding locations for a plurality of probes are provide.
-
-
2. A probe assembly for making electric contact with an electronic circuit element, comprising:
-
a substrate for holding a plurality of probes, the substrate including one or more structures capable of receiving the plurality of probes; a plurality of probes, each comprising; a contact tip portion; a compliant portion functionally attached to the tip portion; and a base portion functionally attached to the compliant portion; wherein the base portions of the plurality of probes are configured to mate with and be at least partially mechanically constrained by their physical configurations and the physical configuration of the one or more structures on the substrate, wherein the tips of at least a portion of the probes, when attached to the substrate, define a substantially planar surface and wherein the base portions and the one or more structures are configured for mating by relative translation in a direction that lies within a plane that is parallel to the plane of the substantially planar surface. - View Dependent Claims (3, 4, 5, 6, 7, 8)
-
Specification