Cantilever microprobes for contacting electronic components and methods for making such probes

• US 7,265,565 B2
• Filed: 01/03/2005
• Issued: 09/04/2007
• Est. Priority Date: 02/04/2003
• Status: Active Grant

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Smalley, Dennis R., Bang, Christopher A., Kruglick, Ezekiel J. J., Chen, Richard T., Lembrikov, Pavel B.
• Primary Examiner(s): TANG, MINH NHUT
• Application Number:
  US11/028,960
• Publication Number:
  US 20050179458A1
• Time in Patent Office: 974 Days
• Field of Search: None
• US Class Current: 324/755.07
• CPC Class Codes: C25D 5/02 Electroplating of selected surface areas
• CPC Class Codes: G01R 1/0483 Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips for IC's with connecting points around the edges only G01R1/0433
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/06716 Elastic
• CPC Class Codes: G01R 1/06727 Cantilever beams
• CPC Class Codes: G01R 1/06738 related to tip portion
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 1/06755 Material aspects
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07357 with flexible bodies, e.g. buckling beams
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06

Abstract

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

Claims

1. An array of cantilever probes for making contact with an electronic circuit element, comprising:

a plurality of independent cantilever probes, each having a base portion, a support functionally connected to the base portion, a cantilever portion functionally connected to the support, and a contact portion functionally connected to the cantilever portion for making contact with the electronic circuit element;

a substrate containing at least two bonding locations for each of the plurality of cantilever probes; and

a bonding material functionally attaching base portions of the cantilever probes to their respective bonding locations on said substrate,

wherein for at least a plurality of pairs of first and second cantilever probes, an opening is provided in a base of the first probe between the at least two bonding locations such that the opening provides a space for bonding for the second probe to be used in bonding the second probe to the substrate without the bonding material for the second probe shorting to the base of first probe whereby interlaced bonding locations for a plurality of probes are provide.

2. A probe assembly for making electric contact with an electronic circuit element, comprising:

a substrate for holding a plurality of probes, the substrate including one or more structures capable of receiving the plurality of probes;

a plurality of probes, each comprising;

a contact tip portion;

a compliant portion functionally attached to the tip portion; and

a base portion functionally attached to the compliant portion;

wherein the base portions of the plurality of probes are configured to mate with and be at least partially mechanically constrained by their physical configurations and the physical configuration of the one or more structures on the substrate,

wherein the tips of at least a portion of the probes, when attached to the substrate, define a substantially planar surface and wherein the base portions and the one or more structures are configured for mating by relative translation in a direction that lies within a plane that is parallel to the plane of the substantially planar surface.

3. The probe assembly of claim 2 wherein the probe comprises a cantilever probe.

4. The probe assembly of claim 3 wherein the base portions and the one or more structures are configured for mechanical interlocking by linear motion between the base portion and the probe in a direction that is substantially parallel to a plane of a surface of the substrate.

5. The probe assembly of claim 4 wherein the base portions and/or the one or more structures comprise a mechanism for locking the base portions and the one or more structures mechanically together when the base portions and the one or more structures are properly positioned relative to each other.

6. The probe assembly of claim 5 wherein the locking occurs automatically when proper positioning is achieved.

7. The probe assembly of claim 5 wherein the locking is made to occur manually when proper positioning is achieved.

8. The probe assembly of claim 4, wherein after locking, the base portion and the one or more structures are capable of being unlocked from each other without damage to the base portions such that the base portions are capable of receiving and locking into position replacement probes.