Micro electric power converter

• US 7,268,659 B2
• Filed: 01/26/2006
• Issued: 09/11/2007
• Est. Priority Date: 03/30/2005
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Device Technology Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Nishio, Haruhiko, Katayama, Yasushi
• Primary Examiner(s): Nguyen; Tuyen T.
• Application Number:
  US11/339,550
• Publication Number:
  US 20060227518A1
• Time in Patent Office: 593 Days
• Field of Search: 336/65, 336/83, 336/192, 336/200, 336/232, 257/531, 363/147
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 23/15 Ceramic or glass substrates H01L23/142, H01L23/145, H01L23/147 take precedence
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19015 including thin film passive components
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H02M 3/155 using semiconductor devices only

Abstract

A thin film magnetic induction element includes a ferrite substrate, a coil provided across the ferrite substrate and including connection conductors and coil conductors, and terminals provided on perimeter portions of the substrate. Terminals capable of being adversely affected by an induced magnetic flux, such as a VDD terminal, a CGND terminal, an IN terminal, a PVDD terminal, a PGND terminal, an FB terminal, a CE terminal, and an AL terminal are arranged along the Y-direction of the substrate, in which the magnetic flux density is low. Terminals substantially incapable of being adversely affected by an induced magnetic flux are arranged along the X-direction of the substrate, in which the magnetic flux density is high. A micro electric power converter having the thin film magnetic induction element is less susceptible to circuit malfunctions.

Claims

1. A micro electric power converter comprising:

a magnetic insulator substrate;

a coil provided across a central portion of the magnetic insulator substrate;

first terminals and second terminals provided on a perimeter portion of the magnetic insulator substrate;

a semiconductor chip comprising circuits connected to the first terminals and the second terminals; and

passive component parts,

wherein a direction perpendicular to a cross section of a coil of the solenoid is designated as an X-direction in which a magnetic flux density generated by current flowing through the coil is high, and a direction perpendicular to the X-direction is designated as a Y-direction in which the magnetic flux density is low, and

wherein the first terminals, through which are transmitted signals capable of causing a circuit malfunction under the influence of voltages induced by the magnetic flux, are arranged along the Y-direction; and

the second terminals, through which are transmitted signals substantially incapable of causing a circuit malfunction under the influence of voltages induced by the magnetic flux, are arranged along the X-direction.

2. The micro electric power converter according to claim 1, wherein the magnetic insulator substrate comprises a ferrite substrate.

3. The micro electric power converter according to claim 1, wherein voltages of the signals transmitted through the first terminals comprise a power supply voltage of a control circuit, a ground voltage of the control circuit, and voltages of analog signals inputted to and outputted from the control circuit.

4. The micro electric power converter according to claim 1, wherein voltages of the signals transmitted through the second terminals comprise digital signal voltages.

5. A micro electric power converter comprising:

a magnetic insulator substrate;

a coil provided across a central portion of the magnetic insulator substrate;

first terminals and second terminals provided on a perimeter portion of the magnetic insulator substrate;

a semiconductor chip comprising circuits connected to the first terminals and the second terminals on one side of the magnetic insulator substrate; and

a printed circuit board connected to the first terminals and the second terminals on the magnetic insulator substrate, the printed circuit board comprising passive component parts mounted thereon;

wherein a direction perpendicular to a cross section of a coil of the solenoid is designated as an X-direction in which a magnetic flux density generated by current flowing through the coil is high, and a direction perpendicular to the X-direction is designated as a Y-direction in which the magnetic flux density is low, and

wherein the first terminals are arranged along the Y-direction when an impedance seen therefrom in the direction of the semiconductor chip is higher than the impedance seen therefrom in the direction of the printed circuit board, and the second terminals are arranged along the X-direction when the impedance seen therefrom in the direction of the semiconductor chip is lower than the impedance seen therefrom in the direction of the printed circuit board.

6. The micro electric power converter according to claim 5, wherein at least a portion of the first terminals transmits signals capable of causing a circuit malfunction under the influence of voltages induced by the magnetic flux.