Low thermal resistance light emitting diode

• US 7,276,739 B2
• Filed: 08/02/2005
• Issued: 10/02/2007
• Est. Priority Date: 03/11/2004
• Status: Active Grant

• Current Assignee: Prolight Opto Technology Corporation
• Original Assignee: Chen-Lun Hsin Chen
• Inventors: Tseng, Hsu-Keng, Hung, Jung-Hao, Chen, Chen-Lun Hsin
• Primary Examiner(s): Pert; Evan
• Assistant Examiner(s): Sandvik; Benjamin P.
• Application Number:
  US11/194,704
• Publication Number:
  US 20050269591A1
• Time in Patent Office: 791 Days
• Field of Search: 257/99, 257/81, 257/98, 257/100
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/641 characterized by the materials

Abstract

A light emitting diode (LED) includes a LED chip, which can transfer electrical power to electric-magnetic wave. A set of lead frame is enclosed by electrical isolator material to form a cavity. An optics lens seats on top of the cavity and is bonded to said electrical isolator material. A submount to carry said LED chip is soldered or adhered to the lead frame and forms the electrical contact from said LED chip to lead frame. A high transparency material is utilized to enclosed the LED chip.

Claims

1. A light emitting diode (LED) package, comprising:

a metallic lead frame having positive lead portion and negative lead portion insulated from one another;

a mold of insulating material wrapped over said metallic lead frame, having a cavity where sections of said metallic lead portions are not covered on bottom side surfaces by said insulating material;

an optical lens formed over said cavity to combine with said mold;

at least one LED chip flip-chip bonded on a submount away from the path of the light emission which has printed circuit printed on the same surface as said chip is mounted to couple said LED chip with said metallic lead portions through electrical coupling to said bottom surfaces; and

transparent material having an index of refraction greater than 1.3 and a transmission coefficient greater than 80% filling the space between the lens and the LED chip.

2. The LED package as described in claim 1, wherein the material for said submount is selected from the group consisting of silicon, metal, composite metal, ceramic, aluminum nitride.

3. The LED package as described in claim 1, wherein said lens has a transmission coefficient of greater than 70% for a wavelength of 550 nm, and is composed of material selected from the group consisting of optical glue, epoxy, glass, silicon glue and Teflon.

4. The LED package as described in claim 1, wherein said transparent material is selected from the group consisting of plastic, epoxy, glass, and silicon gel.

5. The LED package as described in claim 1, wherein either said positive lead portion or said negative lead portion is more than one.

6. The LED package as described in claim 1, wherein said submount is more than one.

7. The LED package as described in claim 1, further comprising a circuit of electrostatic destruction protection (ESD) circuit.