Device for coupling PCB sheet

• US 7,278,193 B2
• Filed: 01/21/2005
• Issued: 10/09/2007
• Est. Priority Date: 02/23/1999
• Status: Expired due to Term

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Choi, Bong Kyu, Choi, Chun Ho
• Primary Examiner(s): CHANG, RICK KILTAE
• Application Number:
  US11/038,048
• Publication Number:
  US 20050128724A1
• Time in Patent Office: 991 Days
• Field of Search: 298/30, 298/31, 294/020.8, 298/32, 174/250, 174/255, 174/52.1, 361/801, 361/802, 361/732, 361/740
• US Class Current: 29/402.08
• CPC Class Codes: B01F 2101/23 Mixing of laboratory samples e.g. in preparation of analysing or testing properties of materials
• CPC Class Codes: B01F 25/50 Circulation mixers, e.g. wherein at least part of the mixture is discharged from and reintroduced into a receptacle
• CPC Class Codes: B01F 31/65 the materials to be mixed being directly submitted to a pulsating movement, e.g. by means of an oscillating piston or air column
• CPC Class Codes: B01F 31/651 Mixing by successively aspirating a part of the mixture in a conduit, e.g. a piston, and reinjecting it through the same conduit into the receptacle
• CPC Class Codes: B01F 33/00 Other mixers; Mixing plants; Combinations of mixers
• CPC Class Codes: G01N 2035/106 by sucking and blowing
• CPC Class Codes: G01N 35/10 Devices for transferring samples or any liquids to, in, or from, the analysis apparatus, e.g. suction devices, injection devices G01N35/0099 takes precedence
• CPC Class Codes: H01L 21/485 Adaptation of interconnections, e.g. engineering charges, repair techniques
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 2203/0165 Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence
• CPC Class Codes: H05K 3/225 Correcting or repairing of printed circuits H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49135 and shaping, e.g., cutting or bending, etc.
• CPC Class Codes: Y10T 29/49149 : by metal fusion bonding
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/4973 : Replacing of defective part
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 29/5317 : Laminated device
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/53196 : Means to apply magnetic force directly to position or hold work part

Abstract

A device is provided for coupling (i) a PCB sheet, which includes a first PCB and a space formed after removing a defective PCB from the PCB sheet, with (ii) a replacement second PCB received in the space and has a connecting part spaced from a periphery of the space by a channel. The device includes a PCB securing plate adapted to support the PCB sheet. PCB securing pins project from an upper surface of the PCB securing plate to be inserted into pin receiving holes of the first and second PCBs for positioning the PCBs. PCB securing tapes are integrally attached on the PCB securing plate for securing the PCB sheet and the second PCB to the PCB securing plate. An adhesive is adapted to be filled into the channel to couple, when cured, the PCB sheet and the second PCB together.

Claims

1. A device for coupling (i) a printed circuit board (PCB) sheet, which includes a first PCB and a space formed after removing a defective PCB from the PCB sheet by cutting a connecting part of the defective PCB, with (ii) a replacement, good quality second PCB, which is received in the space of the PCB sheet and has a connecting part spaced from a periphery of the space of the PCB sheet by a channel, said device comprising:

a PCB securing plate adapted to support the PCB sheet;

a plurality of PCB securing pins projecting from an upper surface of said PCB securing plate, wherein said PCB securing pins are adapted to be inserted into pin receiving holes of the first and second PCBs for positioning the first and second PCBs on said PCB securing plate;

a plurality of PCB securing tapes integrally attached on said PCB securing plate, wherein said tapes are adapted to secure the PCB sheet and the second PCB to said PCB securing plate for preventing loose movements of the second PCB in the PCB sheet; and

an adhesive adapted to be filled into the channel between the PCB sheet and the second PCB and to be cured so as to couple the PCB sheet and the second PCB together.

2. The device as claimed in claim 1, wherein said PCB securing tapes are heat resistant tapes for preventing thermal deformations.

3. The device as claimed in claim 2, wherein said PCB securing tapes are double-face tapes, are put around said PCB securing plate, and are adapted to secure the PCB sheet to said PCB securing plate at respective side edges of the PCB sheet and said PCB securing plate.

4. The device as claimed in claim 1, wherein one said PCB securing tape is put on the upper surface of said PCB securing plate at a allocation adapted to correspond to a bottom of the channel for preventing leakage of said adhesive.

5. The device as claimed in claim 1, wherein said adhesive is a high temperature adhesive for preventing thermal deformations.

6. The device as claimed in claim 1, further comprising a flat cover disposed on said first PCB or said second PCB to protect the same.

7. In combination,

a printed circuit board (PCB) sheet, which includes a first PCB and a space formed after removing a defective PCB from the PCB sheet by cutting a connecting part of the defective PCB;

a replacement, good quality second PCB, which is received in the space of the PCB sheet and has a connecting part spaced from a periphery of the space of the PCB sheet by a channel; and

a device for coupling said PCB sheet with said second PCB, said device comprising;

a PCB securing plate supporting, on an upper surface thereof, the PCB sheet and the second PCB;

a plurality of PCB securing pins projecting from the upper surface of said PCB securing plate and being inserted into pin receiving holes of said first and second PCBs for positioning said first and second PCBs on said PCB securing plate;

a plurality of PCB securing tapes integrally attached on said PCB securing plate, and securing the PCB sheet and the second PCB to said PCB securing plate for preventing loose movements of said second PCB in said PCB sheet; and

an adhesive filled into said channel between said PCB sheet and said second PCB and coupling the PCB sheet and the second PCB together.

8. The combination as claimed in claim 7, wherein said PCB securing tapes are heat resistant tapes for preventing thermal deformations.

9. The combination as claimed in claim 8, wherein said PCB securing tapes are double-face tapes, are put around said PCB securing plate, and secure the PCB sheet to said PCB securing plate at respective side edges of the PCB sheet and said PCB securing plate.

10. The combination as claimed in claim 7, wherein one said PCB securing tape is put on the upper surface of said PCB securing plate at a location corresponding to a bottom of said channel for preventing leakage of said adhesive.

11. The combination as claimed in claim 7, wherein said adhesive is a high temperature adhesive for preventing thermal deformations.

12. The combination as claimed in claim 7, further comprising a flat cover disposed on said first PCB or said second PCB to protect the same.

13. The combination as claimed in claim 7, wherein said channel formed between said PCB sheet and said second PCB and receiving said adhesive therein has a width of 1 to 5 mm.

14. The combination of claim 7, wherein the periphery of the space in the PCB sheet has a recess into which the connecting part of the second PCB projects.

15. The combination of claim 7, wherein the second PCB has several connecting parts arranged around a periphery thereof, and the periphery of the space in the PCB sheet has a number of recesses into each of which one of the connecting parts of the second PCB projects.