Method for fabricating a packaging device for semiconductor die and semiconductor device incorporating same

  • US 7,279,355 B2
  • Filed: 06/27/2003
  • Issued: 10/09/2007
  • Est. Priority Date: 06/27/2003
  • Status: Active Grant
First Claim
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1. A method for fabricating a device, the method comprising:

  • providing a substantially planar substrate having opposed major surfaces, the substrate comprising a through hole extending between the major surfaces;

    providing a slug of an electrically conductive material;

    squeezing the slug into the through hole whereby the slug is retained in the through hole by friction; and

    forming an electrically conductive die mounting pad and an electrically conductive connecting pad on different ones of the major surfaces each pad being in electrical contact with the slug.

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