Multiple seed layers for interconnects

DC
  • US 7,282,445 B2
  • Filed: 01/17/2007
  • Issued: 10/16/2007
  • Est. Priority Date: 10/02/1999
  • Status: Expired due to Term
First Claim
Patent Images

1. A method for depositing two or more seed layers over a substrate, the substrate includes a patterned insulating layer which comprises at least one opening surrounded by a field, the at least one opening and the field being ready for depositing one or more seed layers, the at least one opening having sidewalls and bottom, and the method comprising:

  • a) providing a deposition chamber capable of depositing a continuous seed layer over the sidewalls and bottom of the at least one opening;

    b) providing a PVD chamber capable of depositing a PVD seed layer over the substrate;

    c) configuring an automatic controller with recipe information, the recipe information including deposition sequence, process and timing parameters for operation of the deposition chamber and the PVD chamber;

    d) operating the automatic controller in accordance with the recipe information to deposit in the deposition chamber a continuous seed layer over the sidewalls and bottom of the at least one opening, the continuous seed layer having a thickness greater than about 50Å

    over the field;

    e) operating the controller in accordance with the recipe information to deposit in the PVD chamber a PVD seed layer over the substrate, the PVD seed layer having a thickness greater than about 250 Å

    over the field, and wherein the substrate is not exposed to air atmosphere between depositions of the two seed layers; and

    f) operating the controller in accordance with the recipe information to stop the deposition of the continuous seed layer and the PVD seed layer prior to sealing the at least one opening, thereby leaving enough room for electroplating inside the at least one opening.

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