×

Surface acoustic wave devices for high temperature applications

  • US 7,285,894 B1
  • Filed: 01/31/2005
  • Issued: 10/23/2007
  • Est. Priority Date: 02/13/2004
  • Status: Active Grant
First Claim
Patent Images

1. A Surface Acoustic Wave (SAW) device comprising:

  • a substrate formed from a material selected from the group of the LGX family of crystals and gallium phosphate, the substrate having a SAW propagation surface;

    a first interdigital transducer formed upon said substrate propagation surface with electrodes formed from an electrically conductive material having a high melting temperature, said first transducer operative upon excitation by an oscillator to launch surface acoustic waves across said propagation surface;

    a second interdigital transducer formed upon said substrate propagation surface spaced apart from said first interdigital transducer, said second transducer having electrodes formed upon said propagation surface from an electrically conductive material having a high melting temperature, said second transducer operative to detect said surface acoustic waves; and

    an adhesive layer formed from a zirconium material that does not migrate into said interdigital transducers, said adhesive layer disposed between said substrate and said first and second interdigital transducers.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×