Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
First Claim
Patent Images
1. A spatial light modulator comprising:
- a lower semiconductor substrate comprising circuitry and electrodes;
an upper light transmissive substrate bonded in spaced apart relationship to the lower substrate;
an intermediate substrate disposed between the upper and lower substrates and having an open area for defining a gap between the semiconductor substrate and the light transmissive substrate;
within the gap being disposed a rectangular active area comprising an array of reflective mirrors, wherein the mirrors have mirror edges that are neither parallel nor perpendicular to edges of the active area;
a light blocking material on the upper light transmissive substrate and provided as a rectangular mask; and
wherein the mirrors comprise substantially square mirror plates and torsion hinges that allow the mirror plates to move relative to the upper and lower substrates.
4 Assignments
0 Petitions
Accused Products
Abstract
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
190 Citations
53 Claims
-
1. A spatial light modulator comprising:
-
a lower semiconductor substrate comprising circuitry and electrodes; an upper light transmissive substrate bonded in spaced apart relationship to the lower substrate; an intermediate substrate disposed between the upper and lower substrates and having an open area for defining a gap between the semiconductor substrate and the light transmissive substrate; within the gap being disposed a rectangular active area comprising an array of reflective mirrors, wherein the mirrors have mirror edges that are neither parallel nor perpendicular to edges of the active area; a light blocking material on the upper light transmissive substrate and provided as a rectangular mask; and wherein the mirrors comprise substantially square mirror plates and torsion hinges that allow the mirror plates to move relative to the upper and lower substrates. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53)
-
Specification