Heater chips with a reduced number of bondpads

  • US 7,290,864 B2
  • Filed: 09/30/2005
  • Issued: 11/06/2007
  • Est. Priority Date: 09/30/2005
  • Status: Active Grant
First Claim
Patent Images

1. A heater chip for use in a printing device, comprising:

  • an ink via;

    a first heater array adjacent at least a portion of one side of the ink via;

    a second heater array adjacent at least a portion of another side of the ink via; and

    a bondpad, wherein the bondpad supplies power to at least a portion of the first heater array and to at least a portion of the second heater array.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×