Substrate for mounting a semiconductor
First Claim
1. A substrate comprising a non-electrically conducting material for mounting a semiconductor chip, the substrate comprising a semiconductor chip mounting portion, a number of first electrically conducting contact portions formed on the surface of the material and associated with the mounting portion and adapted to be wire bonded to contacts of the semiconductor chip, a second electrically conducting contact portion formed on the surface of the material, the second electrically conducting contact portion being adapted to be coupled to testing equipment, and a number of electrically conducting paths formed on the surface of the material, the conducting paths electrically connecting the second electrically conducting contact portion to a minority of the first electrically conducting contact portions, the substrate including first electrically conducting contact portions which are not connected by a conducting path to an electrically conducting contact portion adapted to be coupled to testing equipment during a wire bonding operation performed on that first electrically conducting contact portion.
1 Assignment
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Accused Products
Abstract
A substrate (1) is formed from a non-electrically conducting material and is for mounting a semiconductor chip (10). The substrate has a semiconductor chip mounting portion (6). A number of first electrically conducting contact portions (5) are formed on the surface of the material and associated with the mounting portion (6). A second electrically conducting contact portion (3) is formed on the surface of the material, and the second electrically conducting contact portion (3) is adapted to be coupled to testing equipment. A number of electrically conducting paths (4) are formed on the surface of the material. The conducting paths (4) electrically connect the second electrically conducting contact portion (3) to a minority of the first electrically conducting contact portions (5).
9 Citations
18 Claims
- 1. A substrate comprising a non-electrically conducting material for mounting a semiconductor chip, the substrate comprising a semiconductor chip mounting portion, a number of first electrically conducting contact portions formed on the surface of the material and associated with the mounting portion and adapted to be wire bonded to contacts of the semiconductor chip, a second electrically conducting contact portion formed on the surface of the material, the second electrically conducting contact portion being adapted to be coupled to testing equipment, and a number of electrically conducting paths formed on the surface of the material, the conducting paths electrically connecting the second electrically conducting contact portion to a minority of the first electrically conducting contact portions, the substrate including first electrically conducting contact portions which are not connected by a conducting path to an electrically conducting contact portion adapted to be coupled to testing equipment during a wire bonding operation performed on that first electrically conducting contact portion.
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10. A method of electrically connecting an integrated circuit to a substrate comprising a non-electrically conducting material for mounting a semiconductor chip, the substrate comprising a semiconductor chip mounting portion, a number of first electrically conducting contact portions formed on the surface of the material and associated with the mounting portion, a second electrically conducting contact portion formed on the surface of the material, the second electrically conducting contact portion being adapted to be coupled to testing equipment, and a number of electrically conducting paths formed on the surface of the material, the conducting paths electrically connecting the second electrically conducting contact portion to a minority of the first electrically conducting contact portions, the method comprising:
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coupling the second electrically conducting contact portion to said testing equipment; mounting a semiconductor chip on the substrate; performing a wire bonding operation on one of the first contact portions to which the second electrically conductive contact portion is connected by the conducting paths, while monitoring the current on the second electrically conductive contact portion; and performing a wire bonding operation on one of the first contact portions to which the second electrically conductive contact portion is not connected by the conducting paths, while monitoring the current on the second electrically conductive contact portion. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification