Pb free Ag paste composition for PDP address electrode

• US 7,300,606 B2
• Filed: 06/01/2005
• Issued: 11/27/2007
• Est. Priority Date: 06/01/2004
• Status: Expired due to Fees

• Current Assignee: Dongjin Semichem Co., Ltd.
• Original Assignee: Dongjin Semichem Co., Ltd.
• Inventors: Park, Chan-seok, Park, Seong-mo, Chung, Byung-joo, Paek, Sin-hye
• Primary Examiner(s): McGinty; Douglas
• Assistant Examiner(s): THOMAS, JAISON P
• Application Number:
  US11/142,012
• Publication Number:
  US 20060011895A1
• Time in Patent Office: 909 Days
• Field of Search: 252/500
• US Class Current: 252/514
• CPC Class Codes: H01B 1/16 the conductive material comprising metals or alloys
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01J 2211/225 Material of electrodes
• CPC Class Codes: H01J 9/02 Manufacture of electrodes or electrode systems

Abstract

The present invention provides a Pb free Ag paste composition for a PDP address electrode comprising a) 60 to 90% by weight of an Ag powder; b) 1 to 10% by weight of a Pb free inorganic binder; c) 0.001 to 1% by weight of an inorganic thickener; and d) 5 to 38% by weight of an alkali-soluble, negative photoresist composition for fine conductive powder dispersion. The Pb free Ag paste composition according to the invention i) is environment-friendly by using a Pb free inorganic binder, ii) is suitable for the fabrication of fine electrodes by using the prior electrode formation processes, iii) can apply the formed pattern to low temperature sintering processes of not higher than 600° C., iv) does not use a surfactant and stabilizer and has excellent printing, leveling and sintering performances by using an inorganic thickener and conductive Ag powder, and v) enables sintering to be carried out at a sintering target temperature without binder burning off zone.

Claims

1. A Pb free Ag paste composition for a PDP address electrode comprising:

a) 60 to 90% by weight of an Ag powder;

b) 1 to 10% by weight of a Pb free inorganic binder;

c) 0.001 to 1% by weight of an inorganic thickener; and

d) 5 to 38% by weight of an alkali-soluble, negative photoresist composition for fine conductive powder dispersion comprising

i) 5 to 50% by weight of an acrylate copolymer for photoresist, having a molecular weight of 5,000 to 50,000, and represented by formula 1;

2. The Pb free Ag paste composition of claim 1 wherein the Ag powder has a particle shape of sphere.

3. The Pb free Ag paste composition of claim 1 wherein the Ag powder has an average diameter (D50) of 0.5 to 3 μ

m and a maximum diameter (D_max) of 3 to 5 μ

m.

4. The Pb free Ag paste composition of claim 1 wherein the purity of the Ag powder is not less than 96%.

5. The Pb free Ag paste composition of claim 1 wherein the tap density of the Ag powder is 4.3 to 5.0 g/cm³.

6. The Pb free Ag paste composition of claim 1 wherein the Pb free inorganic binder is selected from the group consisting of Bi₂O₃, SiO₂, B₂O₃, ZrO₂, Al₂O₃ and combination thereof and does not contain Na₂O, K₂O, Li₂O or PbO.

7. The Pb free Ag paste composition of claim 1 wherein the Pb free inorganic binder has a glass transition temperature of 350 to 500°

C. and a glass softening temperature of 400 to 500°

C.

8. The Pb free Ag paste composition of claim 1 wherein the Pb free inorganic binder has an average diameter (D₅₀) of 0.5 to 3 μ

m and a maximum diameter (D_max) of3 to 5 μ

m.

9. The Pb free Ag paste composition of claim 1 wherein the Pb free inorganic binder is dried at a temperature between 80 and 300°

C., which is 100°

C. lower than the glass transition temperature of the inorganic binder.

10. The Pb free Ag paste composition of claim 1 wherein the inorganic thickener is selected from the group consisting of silica, kaolin, alumina, mica and combination thereof.

11. The Pb free Ag paste composition of claim 1 wherein the alkali-soluble, negative photoresist composition for fine conductive powder dispersion further comprises a dispersant in an amount not more than 3% by weight.

12. The Pb free Ag paste composition of claim 1 wherein the photopolymerizable monomer is selected from the group consisting of butanediol diacrylate, triethyleneglycol diacrylate, 1,4-butanediol diacrylate, 1,3-butyleneglycol diacrylate, 1,6-hexanediol diacrylate, ethyleneglycol diacrylate, diethyleneglycol diacrylate, trimethylpropane triacrylate (TMPTA), tripropyleneglycol diacrylate (TPGDA), tetraethyleneglycol diacrylate (TTEGDA), trimethylpropane ethoxytriacrylate (TMPEOTA), polyethyleneglycol diacrylate, dipentaerythritolkisaacrylate, dipentaerythritol hydroxypentacrylate, glycerol diacrylate, trimethyolpropane trimethacrylate, pentaerythritol trimetharcylate, pentaerythritol dimethacrylate, sorbitol trimethacrylate, bisphenol A diacrylate derivative, trimethylolpropane triacrylate, dipentaerythritol polyacrylate, and combination thereof.

13. The Pb free Ag paste composition of claim 1 wherein the photopolymerization initiator is selected from the group consisting of 2,4-bistrichloromethyl-6-p-methoxystyryl-s-triazine, 2-p-methoxystyryl-4,6-bistrichloromethyl-s-triazine, 2,4-trichloromethyl-6-triazine, 2,4-trichloromethyl-4-methylnaphthyl-6-triazine, benzophenone, p-(diethylamino)benzophenone, 2,2-dichloro-4-phenoxyacetophenone, 2,2′

-diethoxyacetophenone, 2,2′

-dibutoxyacetophenone, 2-hydroxy-2-methylproliophenone, p-t-butyltrichloroacetophenone, p-t-butyldichloroacetophenone, benzyldimethylketal, 4,4′

-ethylaminobenzophenone, 2-methyl-1-4-methylthiophenyl-2-4-morpholinyl-1-propanone, 2-benzyl-2-dimethylamino- 1-4-4′

morpholinylphenyl-1-butanone, 2,4,6-trimethyl benzoyl, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2-isobutylthioxanthone, 2-dodecylthioxanthone, isopropyl-9H-thioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone-2,2′

-bis-2-chlorophenyl-4,5,4′

, 5′

-tetraphenyl-2′

-1,2′

-biimidazole, and combination thereof.

14. The Pb free Ag paste composition of claim 1 wherein the leveling agent is an anionic copolymer or aralkyl modified polymethylalkylsiloxane compound, and the defoamer is selected from the group consisting of polyester modified polymethylalkylsiloxane, polysiloxane, non-silicone polymer compound, modified urea solution, polyester modified dimethylpolysiloxane, polyester modified dimethylpolysiloxane copolymer, and combination thereof.

15. The Pb free Ag paste composition of claim 1 wherein the plasticizer is selected from the group consisting of paraffin oil, dioctylphthalate, dibutoxyethyl phthalate, tricrysylphosphate, dioctylcebacate, triphenylphosphate, chlorinated biphenyl, dihexylphthalate, hydro terphenyl, dibutylphthalate, dipropylphthalate, diethylphthalate, dimethylphthalate, santicizer, glycerin, and combination thereof.

16. The Pb free Ag paste composition of claim 1 wherein the solvent is selected from the group consisting of carbitolacetate, gammabutyrolactone, diethyleneglycol monobutylether, diethyleneglycol monobutyletheracetate, trimethylpentanediol monoisobutyrate, dipropyleneglycol monoethylether, methylcelosolv, ethylcelosolv, butylcelosolv, methylethylketone, dioxane, acetone, cyclohexanone, cyclopentanone, isobutyl alcohol, isopropyl alcohol, tetrahydrofuran, and combination thereof.

17. A PDP address electrode prepared using the Pb free Ag paste composition according to claim 1.