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Process for making encapsulant for opto-electronic devices

  • US 7,304,102 B2
  • Filed: 12/07/2004
  • Issued: 12/04/2007
  • Est. Priority Date: 06/04/2003
  • Status: Expired due to Fees
First Claim
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1. A method for making an encapsulant for an opto-electronic device or optical component, comprising:

  • processing a glass characterized by a glass refractive index having a value in the range of 1.48 to 1.60 with a variance of less than about 0.001 to form filler particles from the glass having diameters between 1 μ

    m and 500 μ

    m and characterized by a filler refractive index;

    heating the filler particles in an oxygen-containing atmosphere;

    preparing an epoxy including at least a curing agent and characterized by an epoxy refractive index, wherein the filler refractive index and the epoxy refractive index are sufficiently similar such that the encapsulant has optical transmittance of at least 65% when measured at a wavelength in the range of 300 nm to 800 nm at an encapsulant thickness of about 1 mm;

    heating the epoxy to a predetermined temperature for a predetermined duration sufficient to increase the viscosity of the epoxy to a level such that the epoxy is characterized by a settling velocity equal to or greater than a predetermined value;

    mixing the epoxy with the filler particles within a predetermined mixing duration to form the encapsulant;

    cooling the encapsulant to a predetermined temperature sufficient to increase the viscosity of the epoxy in the encapsulant within a predetermined cooling duration; and

    removing air bubbles from the encapsulant within a predetermined defoaming duration.

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