Micromachined fluidic device and method for making same
First Claim
1. A micropump comprising:
- a Silicon On Insulator stack covered in a closure wafer, said stack comprising;
a support wafer, a layer of insulating material covering at least part of said support wafer, and a layer of single-crystal or polycrystalline silicon covering said layer of insulating material and covered by said closure wafer;
said layer of insulating material connecting said support wafer to said silicon layer;
said closure wafer and/or said silicon layer being machined so as to define a cavity between said closure wafer and said silicon layer, the cavity being for filling with liquid and including a pump chamber;
said support wafer comprising at least a first duct passing right through it and situated in register with said cavity;
said layer of insulating material having at least one first zone that is entirely free of material placed at least in line with said first duct so as to co-operate with said cavity to define a first moving member in said silicon layer, the first moving member being suitable, due to its elasticity and under pressure of liquid in said pump chamber, for moving reversibly towards said support wafer, said first moving member forming part of the flap of a liquid inlet control member; and
said micropump further comprising a pumping portion comprising control means fitted with a pump diaphragm to cause the volume of the pump chamber to vary periodically, and liquid outlet control means.
1 Assignment
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Accused Products
Abstract
The fluid-flow device (100) of the invention comprises a stack (30) covered by a closure wafer (20), said stack (30) comprising a support wafer (36), a layer of insulating material (34), and a silicon layer (32). The closure wafer (20) and/or said silicon layer (32) are machined so as to define a cavity (38) between said closure wafer (20) and said silicon layer (32), said support wafer (36) has at least one duct (102) passing right through it, said layer of insulating material (34) presenting at least one zone (35) that is entirely free of material placed at least in line with said duct (102) so as to co-operate with said cavity (38) to define a moving member (40) in said silicon layer (32), the moving member being suitable under the pressure of liquid in said cavity (38) for reversibly moving towards said support wafer (36) until contact is made between said moving member (40) and said support wafer (36).
46 Citations
20 Claims
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1. A micropump comprising:
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a Silicon On Insulator stack covered in a closure wafer, said stack comprising; a support wafer, a layer of insulating material covering at least part of said support wafer, and a layer of single-crystal or polycrystalline silicon covering said layer of insulating material and covered by said closure wafer; said layer of insulating material connecting said support wafer to said silicon layer; said closure wafer and/or said silicon layer being machined so as to define a cavity between said closure wafer and said silicon layer, the cavity being for filling with liquid and including a pump chamber; said support wafer comprising at least a first duct passing right through it and situated in register with said cavity; said layer of insulating material having at least one first zone that is entirely free of material placed at least in line with said first duct so as to co-operate with said cavity to define a first moving member in said silicon layer, the first moving member being suitable, due to its elasticity and under pressure of liquid in said pump chamber, for moving reversibly towards said support wafer, said first moving member forming part of the flap of a liquid inlet control member; and said micropump further comprising a pumping portion comprising control means fitted with a pump diaphragm to cause the volume of the pump chamber to vary periodically, and liquid outlet control means. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A micropump comprising:
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a stack covered in a closure wafer, said stack comprising; a support wafer, a layer of insulating material covering at least part of said support wafer, and a layer of single-crystal or polycrystalline silicon covering said layer of insulating material and covered by said closure wafer; said closure wafer and/or said silicon layer being machined so as to define a cavity between said closure wafer and said silicon layer, the cavity being for filling with liquid and including a pump chamber; said support wafer comprising at least a first duct passing right through it and situated in register with said cavity; said layer of insulating material having at least one first zone that is entirely free of material placed at least in line with said first duct so as to co-operate with said cavity to define a first moving member in said silicon layer, the first moving member being suitable under pressure of liquid in said pump chamber, for moving reversibly towards said support wafer, said first moving member forming part of the flap of a liquid inlet control member; and said micropump further comprising a pumping portion comprising control means fitted with a pump diaphragm to cause the volume of the pump chamber to vary periodically, and liquid outlet control means, wherein a moving portion of the pump is made in said support wafer in register with the pump chamber, an annular volume free of material machined in said support wafer separating the moving pump portion from the remainder of the support wafer, and in that said micropump control means are situated in register with the pump chamber and directly integrated in the micropump by being fixed to said moving pump portion, wherein said moving portion includes at least one liquid pressure detection member, and wherein said pumping portion is provided with an annular liquid pressure detector presenting ducts passing right through said moving portion in an annular zone.
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Specification