Electronics assembly and electronics package carrier therefor

• US 7,324,342 B2
• Filed: 10/19/2005
• Issued: 01/29/2008
• Est. Priority Date: 10/19/2005
• Status: Active Grant

• Current Assignee: Delphi Technologies Ip Limited (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Taylor, Ralph S., Rasmussen, Loren H., Degenkolb, Thomas A.
• Primary Examiner(s): Gandhi; Jayprakash
• Assistant Examiner(s): HOFFBERG, ROBERT JOSEPH
• Application Number:
  US11/253,858
• Publication Number:
  US 20070086163A1
• Time in Patent Office: 832 Days
• Field of Search: 361699-704, 361/715, 361/719, 361/968, 361709-710, 174/16.3, 174/15.1, 174/252, 257/714, 257723-727, 165/80.3, 165/104.33, 165/195, 439/71, 439/331, 439/485, 439/497, 248/27.3, 248/221.11, 248/222.12, 248/632, 248/634
• US Class Current: 361/704
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]

Abstract

An electronics assembly is provided having a carrier that provides a controlled height variability between electronics packages and a heat sink device. The electronics assembly includes a substrate and electronics packages connected to the substrate. The assembly also includes a heat sink device positioned in thermal communication with a first side of the electronics packages. The assembly further includes a carrier disposed between the substrate and the heat sink device. The carrier has a resilient wall that biases the electronics packages towards the heat sink device such that a controlled bond line is provided between the first side of the electronics packages and the heat sink device.

Claims

1. An electronics assembly comprising:

a substrate;

at least one electronics package connected to the substrate, said electronics package comprising electrical circuitry and first and second sides;

a heat sink device positioned in thermal communication with the first side surface of the electronics package; and

a carrier disposed between the substrate and the heat sink device, said carrier comprising a resilient wall for biasing the electronics package towards the heat sink device such that a controlled bond line is provided between the first side of the electronics package and the heat sink device, wherein the carrier further comprises a plurality of fingers formed in the resilient wall that bias the electronics package towards the heat sink device.

2. The electronics assembly as defined in claim 1 further comprising a thermal conductive medium disposed between the first side of the electronics package and the heat sink device.

3. The electronics assembly as defined in claim 2, wherein the thermal conductive medium comprises a thermal conductive adhesive.

4. The electronics assembly as defined in claim 1, wherein the heat sink device comprises a fluid vessel for receiving a cooling fluid.

5. The electronics assembly as defined in claim 1, wherein the electronics assembly is employed on a vehicle.

6. The electronics assembly as defined in claim 1, wherein the substrate comprises a circuit board having electrical circuitry.

7. The electronics assembly as defined in claim 1, wherein the carrier comprises a polymeric carrier having a frame generally defining a recessed area that allows the electronics package to move in a direction normal to the substrate and the heat sink device, while constraining movement of the electronics package in other directions.

8. The electronics assembly as defined in claim 1, wherein the carrier comprises tabs for engaging a surface on the heat sink device.

9. The electronics assembly as defined in claim 1, wherein the substrate comprises openings, and the carrier comprises locating pins that engage the openings.

10. The electronics assembly as defined in claim 1, wherein the electronics assembly comprises a plurality of electronics packages and the carrier comprises a plurality of recessed areas for engaging the electronics packages.

11. The electronics assembly as defined in claim 1 further comprises a thermal conductive pedestal disposed between the substrate and the at least one electronics package.

12. An electronics package carrier for use in an electronics assembly, said carrier comprising:

a frame generally defining at least one area for receiving an electronics package, wherein the electronics package connects to a substrate on a first side and is in thermal communication with a heat sink device on the opposite second side;

a resilient wall formed at the at least one area for biasing the electronics package towards a heat sink device;

connecting members adapted to engage a member of the electronics assembly to hold the electronics package in a desired orientation relative to the heat sink device such as to provide a controlled bond line; and

wherein the connecting members comprising a plurality of upstanding fingers formed on the resilient wall to contact the electronics package.

13. The carrier as defined in claim 12, wherein the carrier comprises a polymeric material.

14. The carrier as defined in claim 12, wherein the connecting members comprise tabs located near opposite sides of the carrier.

15. The carrier as defined in claim 14, wherein the tabs are adapted to engage the heat sink device.

16. The carrier as defined in claim 12, wherein the carrier comprises a recessed area that allows movement of the electronics package in a direction between the substrate and the heat sink device, while constraining motion in other directions.

17. The carrier as defined in claim 12 further comprising locating pins formed on one side of the frame to allow the carrier to be located on the substrate.

18. The carrier as defined in claim 12, wherein the frame defines a plurality of recessed areas for receiving a plurality of electronics packages.